Coil Device Manufacturing Seed Layer Etching Heat Reduction
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Solution Overview
Problem
Current wireless power transfer coil devices face inefficiencies in charging and lifespan due to heat generation, which affects performance and circuit longevity.
Innovation Solution
A method of manufacturing a coil device involving the formation of a seed layer by bonding copper foil to a base layer, followed by etching and plating processes, where a dry film is used to expose and develop the copper foil, and a plating layer is applied through connected ends, enhancing conductivity and reducing heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional coil structure is used for wireless power transfer, then power transfer functionality is achieved, but heat generation increases reducing charging efficiency and device lifespan
Solution Approach 1:
The patent changes the physical and chemical parameters of the coil structure by using a multi-layer seed layer configuration with different materials (copper foil, copper powder, conductive paste) and varying thicknesses. This parameter optimization reduces electrical resistance and improves current distribution, thereby reducing heat generation and improving charging efficiency
Solution Approach 2:
The patent employs composite material structures including copper foil combined with copper powder and conductive paste in layered configurations. These composite seed layers provide optimized electrical conductivity and current distribution properties that reduce resistive heating while maintaining effective power transfer
2Loss of energy
If the coil structure is optimized to reduce heat, then charging efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The seed layer is segmented into multiple distinct layers with different materials and functions. The copper foil provides base conductivity, copper powder fills gaps to enhance current paths, and conductive paste ensures proper adhesion and electrical connection. This segmentation allows each layer to contribute specifically to heat reduction while maintaining manufacturability through standardized layering processes
3Manufacturing precision
If copper foil is bonded to base layer and etching is performed, then precise coil patterns are formed, but manufacturing steps increase
Solution Approach 1:
The copper foil is pre-bonded to the base layer before etching, creating a stable substrate that facilitates precise pattern formation. The multi-layer seed structure is prepared in advance with optimized material combinations that enhance etching uniformity and pattern definition, allowing for high-precision coil patterns while streamlining the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces heat generation, improves charging efficiency, extends the lifespan of the device, and increases circuit performance by optimizing the coil structure and conductivity.
Implementation Method 1
The copper foil may be bonded to the base layer through a hot press process.
Implementation Method 2
changing a portion of the dry film exposed to light into a photocured polymer and leaving a portion of the dry film not exposed to light as an uncured monomer, in response to exposing the dry film to the light
Implementation Method 3
the plating of the plating layer comprises applying a voltage through the connected ends of the seed layer
Data Source
AI summary
A method of manufacturing a coil device and the coil device includes a base layer and a coil pattern formed on a surface of the base layer. The method of manufacturing a coil device includes forming a seed layer of a coil by bonding a copper foil to a base layer, etching to remove a portion of the copper foil, and plating a plating layer on the seed layer.