Coil Component Electrode Structure for Breakdown Voltage and Flatness
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Solution Overview
Problem
Existing coil components face challenges in achieving improved breakdown voltage, reducing leakage magnetic flux, and maintaining flatness of mounting surfaces, particularly as electronic devices miniaturize and require more components with increased performance.
Innovation Solution
A coil component design featuring a body with a core, embedded coil part, insulating layers, and bonded conductive layers with varying surface roughness, where external electrodes cover the bonded conductive layers, enhancing insulation distance and reducing magnetic flux leakage while maintaining flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a plating process is used to form external electrodes, then the thickness of external electrodes can be controlled, but the number of processes increases due to the need for plating resist formation
Solution Approach 1:
The patent extracts and eliminates the plating resist formation step from the electrode formation process. Instead of using a plating process with resist, the invention directly forms electrodes through a screen printing process, removing the unnecessary resist formation and cleaning steps while maintaining precise thickness control through the screen mesh structure.
2Device complexity
If conductive paste is applied to form external electrodes, then the number of processes is reduced, but the thickness of external electrodes increases and the coil component thickness increases
Solution Approach 1:
The patent changes the key parameter of electrode thickness by controlling the screen mesh size and printing pressure. By selecting appropriate screen mesh counts (e.g., 200 mesh, 300 mesh) and adjusting printing parameters, the electrode thickness is precisely controlled to be thinner than traditional conductive paste methods while maintaining good electrical conductivity and adhesion.
3Reliability
If the insulation distance between external electrodes is increased to improve breakdown voltage, then the mounting surface area increases, but the miniaturization of electronic devices is hindered
Solution Approach 1:
The patent transitions from increasing insulation distance in the horizontal plane to increasing it in the vertical dimension. By forming the insulating layer to protrude above the electrode surfaces (creating a raised barrier), the breakdown voltage is improved without increasing the mounting footprint, as the insulation enhancement occurs in the height dimension rather than the planar dimensions.
4Manufacturing precision
If the mounting surface is made flat for precise integration, then the assembly process is simplified, but the insulating structure that improves breakdown voltage may compromise flatness
Solution Approach 1:
The patent applies local quality by making only the central mounting area flat while allowing the peripheral regions to have the protruding insulating structure. The flat region is specifically defined to accommodate mounting components, while the insulating protrusions are positioned at the edges where they provide breakdown voltage protection without interfering with the flat mounting surface.
Data Source
AI summary
A coil component includes a body having a first surface and a second surface opposing each other in a thickness direction of the body and including a core formed in the thickness direction; a coil part embedded in the body and including at least one turn around the core; an insulating layer disposed on the first surface of the body; a bonded conductive layer disposed on the insulating layer and having a surface roughness of the first surface which is in contact with the insulating layer greater than a surface roughness of the second surface opposing the first surface of the bonded conductive layer; and external electrodes connected to the coil part and covering the bonded conductive layer.