Coil Component Electrode Profile for Mounting Strength and Impact Resistance
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Solution Overview
Problem
Existing bottom surface terminal-type coil components face challenges in enhancing impact resistance and mounting strength during assembly on a mounting substrate.
Innovation Solution
The design includes a coil component with a metal magnetic powder-containing resin element body, featuring terminal electrodes with a thickest portion and a thinner section, and bump electrodes that intersect with the terminal electrodes, increasing the solder fillet forming region for improved mounting strength and reducing impact by overlapping the thickest portion orthogonally to the surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the terminal electrode is made uniformly thick, then the manufacturing process is simple, but the mounting strength and impact resistance are insufficient
Solution Approach 1:
The terminal electrode is designed with non-uniform thickness, featuring a thickest portion positioned to overlap with the bump electrode. This local variation in thickness concentrates structural reinforcement where it is most needed for mounting strength and impact resistance, rather than uniformly increasing the entire electrode thickness.
Solution Approach 2:
The patent introduces a vertical dimension variation in the terminal electrode thickness, creating a three-dimensional profile with a thickest portion. This dimensional change allows the electrode to provide enhanced mechanical support and absorb impact forces more effectively while maintaining a compact overall structure.
2Strength
If the outer shape dimensions are increased to improve impact resistance, then the impact resistance improves, but the coil characteristics deteriorate
Solution Approach 1:
Instead of increasing the overall outer dimensions of the electronic component, the patent applies local reinforcement through the thickest portion of the terminal electrode that overlaps with the bump electrode. This localized approach enhances impact resistance without expanding the component's footprint, thereby preserving coil characteristics.
3Strength
If the solder fillet forming region is increased to improve mounting strength, then the mounting strength improves, but the device complexity increases
Solution Approach 1:
The thickest portion of the terminal electrode is strategically positioned to overlap with the bump electrode, creating a localized region that promotes enhanced solder fillet formation. This concentrated approach to improving mounting strength through solder joint enhancement is more efficient than uniformly complicating the entire electrode structure.
Data Source
AI summary
In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.