Coil Component Electrode Layout for Smaller, Short-Resistant Mounting
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Solution Overview
Problem
In miniaturized electronic devices, coil components face challenges due to increased overall length and width from external electrodes, leading to potential electrical shorts when mounted on substrates, and there is a need for improved support substrate stability and reduced component loss during manufacturing.
Innovation Solution
A coil component design featuring a body with opposing surfaces, a support substrate, and lead-out patterns with reinforcing patterns, where slit portions expose lead-out patterns for external electrodes, enhancing bonding force and stability while minimizing component thickness and loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If external electrodes are formed on two surfaces of the body opposing each other, then the coil component can be mounted on a mounting substrate, but the overall length or width of the coil component increases due to thicknesses of the external electrodes
Solution Approach 1:
The patent transitions from forming external electrodes on opposing surfaces (requiring length/width extension) to forming lead-out patterns that extend through the thickness direction of the body. The first lead-out pattern extends from the first surface to the first end surface, and the second lead-out pattern extends from the second surface to the second end surface, utilizing the thickness dimension for electrode placement rather than extending length or width.
2Reliability
If external electrodes are formed on opposing surfaces, then electrical connection is achieved, but the external electrodes may contact adjacent components and generate electrical shorts
Solution Approach 1:
The patent introduces lead-out patterns as intermediary elements between the external electrodes and the coil portion. These lead-out patterns are formed within the body structure, providing isolated electrical pathways that connect external electrodes to the coil portion without exposing electrodes on opposing surfaces that could contact adjacent components.
3Volume of moving object
If the support substrate is made thinner to reduce component size, then miniaturization is achieved, but the support substrate becomes less stable during manufacturing
Solution Approach 1:
The patent applies different structural characteristics to different regions of the support substrate. The first and second slit portions are formed only in edge portions of the first surface, not uniformly across the entire substrate. This localized approach provides structural reinforcement where needed (at edges where lead-out patterns emerge) while maintaining overall miniaturization.
4Ease of manufacture
If slit portions are formed to expose lead-out patterns, then external electrodes can be connected, but manufacturing precision requirements increase
Solution Approach 1:
The lead-out patterns are formed within the body structure before the slit portions are created. By pre-positioning the lead-out patterns and establishing their paths from the surfaces to the end surfaces, the subsequent formation of slit portions becomes a simpler exposure process rather than a complex alignment task, reducing manufacturing precision requirements.
Data Source
AI summary
A coil component includes a body, a support substrate disposed in the body, and a coil portion including a first coil pattern on one surface of the support substrate, a first lead-out pattern extending from the first coil pattern to an end surface of the body, and a second lead-out pattern disposed on the one surface of the support substrate to be spaced apart from the first coil pattern and extending to another end surface of the body. A reinforcing pattern portion is disposed between each lead-out pattern and the one surface of the support substrate, first and second slit portions are disposed in edge portions of the body and respectively expose the first and second lead-out patterns, and first and second external electrodes are respectively disposed on the inner surfaces of the first and second slit portions and respectively connected to the first and second lead-out patterns.