Coil Component Electrode Layout for Miniaturization and Plating Control
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Solution Overview
Problem
The miniaturization of coil components is limited by the need for appropriate inductance and direct current resistance values, making it challenging to reduce their size while maintaining performance in electronic devices.
Innovation Solution
A coil component design that includes a body with specific surface orientations, a coil portion, insulating layers, and external electrodes, where the insulating layers are strategically positioned to minimize external electrode size and prevent plating spread, allowing for reduced dimensions and increased volume efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the coil component size is reduced, then miniaturization is achieved, but the inductance and direct current resistance values become inappropriate
Solution Approach 1:
The external electrode is divided into a plate portion and a protruding portion that extends onto the side surface. This segmentation allows the electrode to maintain appropriate electrical connection area for reliable inductance and DC resistance while reducing the overall footprint of the coil component, thus achieving miniaturization without compromising electrical performance.
Solution Approach 2:
The external electrode extends from the end surface onto the side surface of the coil component, utilizing a third dimension (side surface) in addition to the traditional end surface placement. This dimensional transition increases the effective electrode area without increasing the planar footprint, enabling miniaturization while maintaining appropriate electrical characteristics.
2Area of moving object
If the external electrode size is reduced, then miniaturization is achieved, but plating spread increases
Solution Approach 1:
The insulating layer is selectively applied only to specific regions (side surfaces and/or end surfaces) where plating spread control is needed, rather than covering the entire component. This localized insulation approach prevents plating spread in critical areas while maintaining minimal external electrode size for miniaturization, addressing the contradiction between electrode size reduction and plating control.
3Volume of moving object
If the coil component size is reduced, then miniaturization is achieved, but the volume of the body decreases
Solution Approach 1:
The external electrode utilizes the side surface of the body, transitioning from two-dimensional end surface placement to three-dimensional multi-surface configuration. This allows the body volume to be minimized for miniaturization while the electrode maintains adequate connection area by wrapping around or extending onto vertical surfaces, effectively decoupling body volume from electrode functionality.
Data Source
AI summary
A coil component includes: a body having first and second surfaces opposed in a length direction, third and fourth surfaces opposed in a width direction, and fifth and sixth surfaces opposed in a thickness direction; a coil portion disposed inside the body; a first insulating layer covering a portion of each of the fifth surface of the body and the sixth surface of the body; a second insulating layer covering a portion of the third surface of the body and the fourth surface of the body; a first external electrode disposed on the first surface of the body; and a second external electrode disposed on the second surface of the body.