Stacked Coil Component Outer Electrode Plating and Embedding
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Solution Overview
Problem
Existing coil components face challenges in improving the surface characteristics of outer electrodes, leading to poor wettability during solder-mounting and increased risk of electrode peeling due to stress and unevenness.
Innovation Solution
A coil component design featuring an outer electrode with a plating surface that is dense and has minimal unevenness, where the electrode portion is embedded within the element body, reducing voids and enhancing joining strength through an anchor effect, and incorporating a baked electrode layer with a glass component for improved adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a plated layer is disposed on the surface of the outer electrode, then the surface characteristics are improved, but the plated layer may peel off due to stress and unevenness
Solution Approach 1:
The patent applies different surface treatments to different regions of the outer electrode. The plating surface is specifically treated to have high flatness and few defects, while other regions may have different characteristics. This local optimization ensures that the plated layer adheres properly where it is most needed, preventing peeling while maintaining good surface characteristics for soldering.
Solution Approach 2:
The patent performs preliminary surface preparation on the outer electrode before applying the plated layer. By pre-treating the surface to ensure high flatness and minimal defects, the foundation is prepared in advance to support the plated layer, preventing subsequent peeling issues while achieving the desired surface characteristics.
2Manufacturing precision
If the outer electrode surface is made dense and smooth, then solder wettability is improved, but the joining strength between the electrode and element body may be reduced
Solution Approach 1:
The patent creates different surface characteristics in different regions of the outer electrode. The plating surface is made dense and smooth to improve solder wettability, while the joining surface that contacts the element body maintains higher roughness to ensure strong mechanical bonding. This spatial differentiation of surface properties resolves the contradiction between smoothness for soldering and roughness for bonding strength.
3Manufacturing precision
If the electrode portion is embedded in the element body, then the surface characteristics are improved, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the outer electrode into distinct functional regions: an embedded portion within the element body and a protruding plating surface. This segmentation allows the embedded portion to provide structural support and improved surface characteristics, while the protruding portion facilitates soldering. The clear division simplifies the manufacturing process by defining specific functional zones with different requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved surface characteristics enhance solder wettability and reduce the risk of electrode peeling, while the embedded design and baked electrode layer secure strong joining between the element body and outer electrodes, ensuring reliability and durability.
Implementation Method 1
an outer electrode disposed in the element body. The outer electrode includes an electrode portion which includes a joining surface joined to the element body and a plating surface opposite to the joining surface and is formed by plating
Implementation Method 2
the electrode portion may include a baked electrode layer that includes the joining surface and contains a glass component
Data Source
AI summary
A stacked coil component includes: an element body, a coil disposed inside the element body; and a first outer electrode and a second outer electrode which are disposed in the element body. Each of the first outer electrode and the second outer electrode includes an electrode portion which includes a joining surface joined to the element body, and a plating surface opposite to the joining surface and is formed by plating, and of which at least a part is embedded in the element body.