Coil Component Electrode Layout to Prevent Plating Spread
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Solution Overview
Problem
The formation of external electrodes on coil components through plating processes often results in defects due to plating spread, which is a challenge in reducing the size and improving integration of electronic devices.
Innovation Solution
A coil component design featuring slit portions in the body, external electrodes connected to the coil unit, and a cover insulating layer that covers these electrodes, preventing plating spread and ensuring smooth electrode formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If external electrodes are formed on surfaces of a body through a plating process to reduce the size of the coil component, then the size of the coil component is reduced, but defects in appearance of the external electrodes occur due to plating spread
Solution Approach 1:
The body is divided into multiple surfaces, with only the mounting surface exposed for external electrodes. The side surfaces are segmented and covered by the cover insulating layer to prevent plating spread, while maintaining the mounting surface accessibility for electrode formation.
Solution Approach 2:
The cover insulating layer acts as an intermediary between the external electrodes and the side surfaces of the body. It prevents direct contact and plating spread to side surfaces while allowing the electrodes to be properly formed on the mounting surface.
2Ease of operation
If external electrodes are exposed on multiple surfaces of the body, then ease of mounting is improved, but plating spread occurs causing appearance defects
Solution Approach 1:
Different surfaces of the body have different qualities: the mounting surface is exposed to allow electrode formation and mounting, while the side surfaces are covered by the insulating layer to prevent plating spread. This local differentiation resolves the contradiction between mounting ease and appearance quality.
3Volume of moving object
If the coil component is reduced in size for better integration, then device integration is improved, but plating defects become more prominent
Solution Approach 1:
The cover insulating layer serves as a protective intermediary that prevents plating defects on side surfaces while allowing the mounting surface to maintain proper electrode formation. This enables size reduction without compromising electrode reliability.
Solution Approach 2:
The body surfaces are segmented into mounting surface (exposed) and side surfaces (covered), allowing size reduction while preventing plating defects on the covered portions.
Data Source
AI summary
A coil component includes: a body having one surface, and opposite end surfaces facing each other while each being connected to the one surface; a coil unit disposed within the body; slit portions formed in edges at which the one surface of the body meets the opposite end surfaces of the body, respectively; first and second external electrodes disposed on the opposite end surfaces of the body, each thereof being connected to the coil unit, and extending to the one surface of the body through the slit portions, respectively; and a cover insulating layer covering each of the first and second external electrodes disposed on the opposite end surfaces of the body and on the slit portions.