Multilayer Coil External Electrode Plating Stress Dispersion
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Solution Overview
Problem
In the manufacturing of coil components, the plating layer formation process often leads to stress-induced peeling of the external electrode layer from the element body, resulting in incomplete or faulty electrode connections.
Innovation Solution
The external electrode layer is designed with a plating layer scattered in multiple places along its edge, rather than uniformly covering it, which disperses the stress generated during plating formation, preventing peeling and ensuring a secure bond between the electrode layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the plating layer is formed to cover the entire electrode layer edge, then the external electrode has complete coverage and uniform appearance, but stress concentration occurs during plating formation causing the electrode layer to peel off
Solution Approach 1:
The plating layer is segmented into multiple separate regions along the edge of the electrode layer rather than forming a continuous coverage. This segmentation disperses the stress that occurs during plating formation, preventing concentration of stress at any single point and thereby suppressing peeling of the electrode layer from the element body.
Solution Approach 2:
The plating layer is selectively applied only to specific regions along the edge of the electrode layer rather than uniformly across the entire edge. This local quality approach allows the plating to provide reinforcement where needed while avoiding stress concentration in other areas, maintaining electrode integrity without causing peeling.
2Stability of the object's composition
If the plating layer is formed continuously across the electrode layer, then the external electrode achieves uniform coverage, but stress generated during plating formation causes peeling at the edges
Solution Approach 1:
The plating layer is divided into multiple discrete segments positioned at different locations along the edge of the electrode layer. This segmentation maintains the external electrode's uniform appearance and composition while preventing continuous stress application that would cause peeling, thereby preserving bond strength between the electrode layer and element body.
3Object-affected harmful factors
If the plating layer covers the entire edge of the electrode layer, then complete edge protection is achieved, but stress concentration during plating formation leads to electrode peeling
Solution Approach 1:
The plating layer is segmented into multiple separate regions along the edge rather than forming continuous coverage. This segmentation provides edge protection by reinforcing the electrode layer at multiple points while simultaneously preventing stress-induced peeling by avoiding continuous stress application along the entire edge.
Solution Approach 2:
The segmented plating layer acts as an intermediary structure that provides protective reinforcement to the electrode layer edge while mediating the stress distribution during plating formation. Instead of allowing stress to concentrate continuously along the edge, the segmented structure interrupts stress transmission, preventing peeling while maintaining edge protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses peeling of the external electrode, maintaining the integrity of the electrode connections and enhancing the reliability of the coil component.
Implementation Method 1
a plating layer disposed on the external electrode layer
Data Source
AI summary
A multilayer coil component includes: an element body; a coil disposed in the element body; and a first external electrode disposed on a surface of the element body in which the first external electrode has a first electrode layer disposed on the surface of the element body and a first plating layer and a second plating layer disposed on the first electrode layer, and the first plating layer and the second plating layer are disposed so as to be scattered in a plurality of places on an edge of the first electrode layer.