Coil Component Electrode Opening Structure for Thin Solder Fillets
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization of electronic devices has led to increased density of electronic components on mounting boards, resulting in reduced distances between components and a need for thinner solder connections to prevent electrical short-circuits, which conventional coil components struggle to achieve effectively.
Innovation Solution
A coil component design featuring a body with a support substrate and coil portion, where external electrodes have openings to expose the support substrate, reducing the thickness of the solder fillet and minimizing the risk of electrical short-circuits by reducing the effective mounting area and improving bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the distance between adjacent electronic components is reduced to increase component density, then productivity is improved, but the risk of electrical short-circuits increases due to insufficient solder thickness control
Solution Approach 1:
The patent extracts the mounting surface area by forming openings in the external electrode, exposing the support substrate. This reduces the effective area where solder can accumulate and form excessive fillets, thereby preventing electrical short-circuits while maintaining component density.
Solution Approach 2:
The patent applies different properties to different parts of the external electrode. The openings are strategically positioned to control solder flow locally, allowing sufficient solder thickness for reliability while preventing excessive solder accumulation that could cause short-circuits in high-density mounting scenarios.
2Reliability
If the solder fillet thickness is reduced to prevent electrical short-circuits, then electrical short-circuit risk is reduced, but bonding reliability deteriorates
Solution Approach 1:
The support substrate acts as an intermediary between the external electrode and the mounting board. By exposing the support substrate through openings, it provides a controlled interface that manages solder flow and distribution, ensuring adequate bonding strength while preventing excessive solder fillet formation.
Solution Approach 2:
The patent changes the geometric parameters of the external electrode by introducing openings with specific dimensions and positions. This controls the solder fillet thickness parameter during mounting, optimizing it to prevent short-circuits while maintaining sufficient bonding reliability.
3Reliability
If the external electrode area is reduced to minimize solder fillet volume, then electrical short-circuit risk is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The openings in the external electrode are formed in advance during the electrode manufacturing process, before the mounting stage. This preliminary action ensures precise control over the mounting surface area and solder fillet volume, reducing the need for high precision during the actual mounting operation.
Data Source
AI summary
A coil component includes a body, a support substrate embedded in the body and having one end surface exposed to an external surface of the body, a coil portion disposed on the support substrate to be embedded in the body and having one end portion exposed to the external surface of the body together with the one end surface of the support substrate, and an external electrode disposed on the external surface of the body to be connected to the one end portion of the coil portion. The external electrode has an opening exposing at least a portion of the one end surface of the support substrate.