Metal Nitride Insulating Films for Heat-Dissipating Coil Components
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Solution Overview
Problem
The reduction in size and thickness of electronic devices has led to challenges in heat dissipation for coil components, as parylene's low thermal conductivity hampers efficient heat transfer, resulting in decreased saturation current properties and high-current efficiency with increasing temperature.
Innovation Solution
A coil component design featuring a body with a coil supported by an insulating material, covered by a double layer of insulating films, where at least one of the films includes metal nitride, enhancing thermal conductivity and heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If parylene is used as an insulating material for the coil, then electrical insulation is provided, but heat dissipation is hindered due to low thermal conductivity
Solution Approach 1:
The patent applies composite materials by combining parylene with metal nitride particles (such as aluminum nitride, silicon nitride, or boron nitride) to create a composite insulating material. This composite structure maintains the electrical insulation properties of parylene while incorporating the high thermal conductivity of metal nitride particles, thereby resolving the contradiction between electrical insulation and heat dissipation. The metal nitride particles act as thermal pathways within the polymer matrix, enabling effective heat transfer without compromising electrical isolation.
2Volume of moving object
If the size and thickness of the coil component are reduced, then miniaturization is achieved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent applies parameter changes by modifying the thermal conductivity parameter of the insulating material through the addition of metal nitride particles. This changes the thermal transport properties of the material system, enabling effective heat dissipation even in miniaturized coil components where traditional materials would fail due to insufficient thermal pathways in the reduced volume.
3Loss of energy
If metal nitride is added to the insulating film, then thermal conductivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent utilizes porous materials by incorporating metal nitride particles into the parylene matrix, creating a composite structure with distributed thermal pathways. This approach achieves high thermal conductivity without requiring complex manufacturing processes, as the particles can be integrated during standard coating or lamination steps. The porous or particulate composite structure provides thermal management functionality while maintaining compatibility with existing manufacturing techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved heat dissipation properties of the coil component lead to increased high-current efficiency by facilitating the transfer of heat away from the coil, thereby maintaining performance even at elevated temperatures.
Implementation Method 1
at least one of the first inorganic compound and the second inorganic compound include metal nitride
Data Source
AI summary
A coil component includes a body, a coil disposed within the body, a first insulating film covering a surface of the coil, where the first insulating film includes a first inorganic compound, and a second insulating film covering a surface of the first insulating film, where the second insulating film includes a second inorganic compound, wherein at least one of the first inorganic compound and the second inorganic compound include metal nitride.