Coil-Integrated Power Supply Thermal Diffusion via Inner Layer Conductor
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Solution Overview
Problem
Existing coil-integrated switching power supply modules face issues with heat concentration due to reduced size, leading to increased reliability risks and poor heat radiation, especially when cooling mechanisms like fans are absent or environmental temperatures are high.
Innovation Solution
A multilayer substrate with spiral coil conductor patterns and a thermal diffusion conductor pattern that extends across the substrate, along with through holes and a magnetic core, enhances heat diffusion and radiation through a thermal coupling member to an external heat sink, preventing high temperature intensities and maintaining low module temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the coil-integrated switching power supply module is reduced, then the integration density is improved, but heat radiation becomes insufficient and reliability deteriorates
Solution Approach 1:
The patent utilizes the inner layer of the multilayer substrate to extend the thermal diffusion conductor pattern in the vertical dimension, creating additional heat dissipation pathways that do not occupy extra horizontal space. This allows improved heat radiation while maintaining compact module dimensions.
Solution Approach 2:
The inner layer conductor pattern serves dual functions: it provides electrical connectivity for the circuit while simultaneously acting as a thermal diffusion pathway. This multi-functionality enables effective heat dissipation without requiring separate dedicated cooling structures that would increase module size.
2Temperature
If cooling mechanisms are added to improve heat radiation, then temperature control is improved, but device complexity increases
Solution Approach 1:
The multilayer substrate's inner layer conductor pattern inherently provides thermal diffusion capability as part of its structural design. The system uses its own existing components (conductor traces, substrate layers) for heat dissipation rather than requiring external cooling mechanisms, thereby maintaining simplicity while achieving effective temperature control.
3Power
If high power is processed to improve output capability, then power delivery is improved, but heat generation increases and reliability deteriorates
Solution Approach 1:
The patent segments the heat dissipation function across multiple layers of the substrate, with the inner layer specifically dedicated to thermal diffusion. This segmentation allows high power processing in the outer layers while the inner layer simultaneously manages the generated heat, enabling high power delivery without compromising reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution efficiently diffuses and radiates heat from the coil conductor patterns, reducing the risk of overheating and maintaining the module's temperature at a low level, thereby improving reliability and reducing the need for additional cooling measures.
Implementation Method 1
A thermal diffusion conductor pattern is provided on an inner layer of the multilayer substrate. The thermal diffusion conductor pattern continuously extends in areas where the coil conductor patterns are provided and outside areas where the coil conductor patterns are provided
Implementation Method 2
heat radiation through a thermal coupling member to an external heat sink, preventing high temperature intensities and maintaining low module temperatures
Data Source
AI summary
A coil-integrated switching power supply module that provides an improved heat radiation effect to keep the temperature of the entire coil-integrated switching power supply module to a lower value includes a thermal diffusion conductor pattern arranged around a hole through which a magnetic core extends on a layer. The thermal diffusion conductor pattern continuously extends in areas where coil conductor patterns are located on other layers and outside areas where the coil conductor patterns are located on the other layers. In addition, the thermal diffusion conductor pattern includes slits at portions thereof and does not define a closed loop around the hole through which the magnetic core extends.