Coil Component Interlayer Film for Stronger Electrode Bonding
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Solution Overview
Problem
Conventional electronic components, such as coil components, experience a reduction in joint strength due to the migration of impurity atoms between the conductor and external electrodes, which occurs due to heat or voltage application, leading to void formation and reduced bonding strength.
Innovation Solution
An electronic component design featuring a metal film with specific metal particles having an average aspect ratio of 0.8 to 1.2, positioned between the conductor and external electrodes, which are connected via metallic bonds, and optionally an oxide film with a thickness of 200 nm or smaller, to inhibit impurity atom migration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional metal film is used between the conductor and external electrode, then the structure is simple and easy to manufacture, but impurity atoms migrate between the conductor and external electrode due to heat or voltage application, forming voids and reducing joint strength
Solution Approach 1:
The patent changes the physical parameters of the metal film by controlling the aspect ratio of metal particles to be between 0.8 and 1.2, and controlling the average particle size to be 10 nm to 100 nm. These parameter changes create a dense film structure that prevents impurity atom migration while maintaining manufacturability through sputtering processes.
Solution Approach 2:
The patent uses a composite metal film structure consisting of metal particles with specific aspect ratios embedded in a matrix material. This composite structure combines the benefits of metal conductivity with the protective properties of the matrix, creating a barrier against impurity migration while maintaining electrical connectivity.
2Length of stationary object
If the metal particles have a high aspect ratio, then the film thickness can be reduced, but the film becomes less dense and more prone to impurity migration
Solution Approach 1:
The patent optimizes the aspect ratio parameter of metal particles to fall within the specific range of 0.8 to 1.2. This parameter optimization achieves a balance between film thickness and density, ensuring that the film is thin enough to maintain electrical performance while dense enough to prevent impurity atom migration pathways.
3Ease of manufacture
If the metal particles are made larger, then the manufacturing process is simpler, but the film density decreases and void formation increases
Solution Approach 1:
The patent specifies the particle size parameter to be within 10 nm to 100 nm, which is small enough to ensure dense packing and prevent void formation, yet large enough to be manufactured using conventional sputtering techniques. This parameter range reconciles the conflict between manufacturing ease and film density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces impurity atom migration between the conductor and external electrodes, enhancing the joint strength and reliability of the electronic component.
Implementation Method 1
a metal film which contains metal particles and in which an average value of β/α is 0.8 to 1.2, where for each of the metal particles, α is a dimension of the metal particle in a direction horizontal to a boundary interface between the conductor and the metal film, and β is a dimension of the metal particle in a direction perpendicular to the boundary interface
Implementation Method 2
the metal film may be a sputtered film
Implementation Method 3
at least a part of the conductor and at least a part of the metal film may be connected with each other by metallic bond
Implementation Method 4
the electronic component may further comprise an oxide film positioned between the conductor and the metal film, wherein the oxide film may have a thickness of 200 nm or smaller
Data Source
AI summary
One object of the present invention is to provide an electronic component less prone to migration of impurity atoms between a conductor and an external electrode. A coil component as an electronic component includes: a base body; a conductor; a first external electrode electrically connected to the conductor; a second external electrode electrically connected to the conductor; and a metal film positioned between the conductor and the first external electrode, wherein the metal film contains metal particles configured such that an average of β/α is 0.8 to 1.2, where for each of the metal particles, α is a dimension of the metal particle in a direction horizontal to a boundary interface, and β is a dimension of the metal particle in a direction perpendicular to the boundary interface.