Coil Device Lateral Exposure for Mounting Strength
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Solution Overview
Problem
Existing coil devices with a gap between cores suffer from weak magnetic coupling and inadequate mounting strength for coils on a mounting board, making it difficult to securely attach and maintain the coils.
Innovation Solution
A coil device design featuring a pair of first and second cores with a third core in between, where the coils are partly exposed laterally to form solder fillets, enhancing mounting strength and allowing for thinner, more compact designs by opposing plate surfaces and using plate-like coil configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a gap is formed between the first core and the third core and between the second core and the third core, then the magnetic coupling between the first coil and the second coil can be weak, but the mounting strength for the mounting board is insufficient
Solution Approach 1:
The invention changes the mounting approach from planar (on the board surface) to three-dimensional (vertical exposure). The coils are configured to be partly exposed in the lateral direction of the cores, allowing solder fillets to be formed on the exposed portions. This vertical/dimensional approach to mounting provides sufficient mounting strength while maintaining the gap structure for weak magnetic coupling.
2Volume of moving object
If the coils are completely enclosed between the cores, then the structure is compact, but the mounting strength is insufficient
Solution Approach 1:
The invention applies local quality by selectively exposing only the necessary portions of the coils (lateral parts) while keeping the rest enclosed between the cores. This localized exposure provides the required mounting strength through solder fillet formation on the exposed parts, while maintaining the compact enclosed structure for the majority of the coil volume.
3Length of moving object
If the coil device is made thin in the array direction of the cores, then the device can be downsized, but the mounting strength may be compromised
Solution Approach 1:
The invention compensates for the reduced thickness in the array direction by utilizing the lateral dimension for mounting. The coils are partly exposed in the lateral direction of the cores, allowing solder fillets to be formed vertically on the exposed portions. This dimensional shift provides sufficient mounting strength despite the thin profile in the array direction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves mounting strength and allows for a more compact, high-density coil device with favorable magnetic characteristics by forming solder fillets and optimizing coil placement between cores.
Implementation Method 1
a solder fillet can thereby partly be formed on the first coil exposed in a lateral direction of any of the cores and the second coil exposed in a lateral direction of any of the cores, and the solder fillets can increase the mounting strength for the mounting board
Implementation Method 2
a coil device used as an inductor or so
Data Source
AI summary
A coil device includes a pair of first core and second core, a third core, and a pair of first coil and second coil. The third core is disposed next to the first core or the second core. The pair of first coil and second coil is each disposed between any two of the first core, the second core, and the third core next to each other. Plate surfaces of the first coil and the second coil are opposed to each other. Each of the first coil and the second coil is partly exposed in a lateral direction of the first core, the second core, or the third core.