Coil Component Insulating Layer for Heat Dissipation and Adhesion
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Solution Overview
Problem
The increasing current in coil components leads to a need for improved heat dissipation and prevents defects such as peeling of the coating layer and chip adhering, which are not adequately addressed by existing technologies.
Innovation Solution
A coil component design incorporating a body with a coil portion, external electrodes, and a surface insulating layer containing fillers with a specific ratio of cross-sectional area, enhancing heat dissipation while preventing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the filler ratio in the surface insulating layer is increased to improve heat dissipation, then thermal conductivity is improved, but the coating layer may peel off
Solution Approach 1:
The patent optimizes the filler ratio parameter within a specific range (25%-40% cross-sectional area ratio) to achieve the best balance between heat dissipation performance and coating adhesion. This parameter optimization prevents both peeling defects and chip adhering defects while maximizing thermal conductivity.
Solution Approach 2:
The surface insulating layer uses a composite material system combining insulating resin with thermally conductive fillers (such as aluminum oxide, aluminum nitride, or boron nitride). This composite structure enables simultaneous achievement of electrical insulation, thermal conduction, and mechanical adhesion properties.
2Temperature
If the filler ratio in the surface insulating layer is increased to improve heat dissipation, then thermal conductivity is improved, but chip adhering defects occur
Solution Approach 1:
The patent optimizes the filler ratio parameter within a specific range (25%-40% cross-sectional area ratio) to achieve the best balance between heat dissipation performance and chip adhesion. This parameter optimization prevents both peeling defects and chip adhering defects while maximizing thermal conductivity.
3Ease of manufacture
If a conventional surface insulating layer is used, then manufacturing is simple, but heat dissipation performance is insufficient
Solution Approach 1:
The surface insulating layer uses a composite material system combining insulating resin with thermally conductive fillers (such as aluminum oxide, aluminum nitride, or boron nitride). This composite structure enables simultaneous achievement of electrical insulation, thermal conduction, and mechanical adhesion properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat and prevents defects like peeling and chip adhering, ensuring reliable operation of the coil component.
Implementation Method 1
a surface insulating layer disposed on the body and including fillers, in which a ratio of a cross-sectional area of the fillers to a cross-sectional area of the entire surface insulating layer is 25% or more and 40% or less
Data Source
AI summary
A coil component includes a body, a coil portion disposed in the body and including lead-out portions exposed to one surface of the body; external electrodes disposed on the body and connected to the lead-out portions, and a surface insulating layer disposed on the body and including fillers, in which a ratio of a cross-sectional area of the fillers to a cross-sectional area of the entire surface insulating layer is 25% or more and 40% or less in a cross section of the surface insulating layer.