Coil Component Layout That Prevents Mounting Rotation and Inductance Loss

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Solution Overview

Problem

Two-terminal type coil components with a single coil conductor incorporated in an element body tend to rotate during mounting on a circuit board due to solder surface tension, and the addition of a dummy bump conductor to prevent rotation reduces the inner diameter of the coil pattern, thereby decreasing inductance.

Innovation Solution

A coil component design featuring an element body with a mounting surface and multiple conductor layers, including bump and dummy bump conductors, where the outer peripheral ends of the coil patterns are connected through via holes and dummy connection patterns with cutout parts, allowing for increased inner and outer diameters while maintaining mounting stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a dummy bump conductor is provided to prevent rotation of the coil component during mounting, then mounting stability is improved, but the inner diameter of the coil pattern is reduced, causing inductance to decrease

Engineering Contradiction:
Improvemounting stabilityVSAvoidinner diameter of coil pattern
Core Design Contradiction:
ReliabilityVSLength of moving object

Solution Approach 1:

The invention introduces a new spatial dimension by utilizing the corner regions of the mounting surface for dummy bump conductors. This allows the dummy conductors to be positioned at the periphery rather than occupying central space, thereby preventing rotation while preserving the inner diameter of the coil pattern. The dummy bump conductors are disposed at corners of the mounting surface, utilizing unused corner spaces to achieve rotational prevention without compromising inductance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If a dummy bump conductor is provided to prevent rotation of the coil component during mounting, then mounting stability is improved, but the outer diameter of the coil pattern is reduced, causing inductance to decrease

Engineering Contradiction:
Improvemounting stabilityVSAvoidouter diameter of coil pattern
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The dummy bump conductors are positioned at the corner regions of the mounting surface, utilizing the peripheral dimension rather than central space. This spatial arrangement allows the outer peripheral ends of the coil patterns to extend closer to the mounting surface corners, maximizing the outer diameter while maintaining rotational stability through the corner-positioned dummy conductors.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Length of moving object

If the inner diameter of the coil pattern is increased to maintain inductance, then inductance is improved, but the dummy bump conductor cannot be provided, causing rotational deviation during mounting

Engineering Contradiction:
Improveinner diameter of coil patternVSAvoidmounting stability
Core Design Contradiction:
Length of moving objectVSReliability

Solution Approach 1:

The invention resolves this contradiction by relocating the dummy bump conductors to the corner regions of the mounting surface, utilizing the peripheral dimension. This allows the coil pattern to maintain a large inner diameter for sufficient inductance while the corner-positioned dummy conductors provide rotational prevention during mounting, achieving both goals simultaneously.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20240290529A1Coil component
Publication Date: 2024.08.29 TDK CORP
  • US20240290529A1 patent drawing
  • US20240290529A1 patent drawing
  • US20240290529A1 patent drawing

AI summary

Disclosed herein is a coil component that includes plural conductor layers embedded in the element body, first and second bump conductors, and first and second dummy bump conductors. Each of the conductor layers includes a coil pattern, first and second connection patterns respectively connected to the first and second bump conductors, and first and second dummy connection patterns respectively connected to the first and second dummy bump conductors. The conductor layers include first and second conductor layers. The first dummy connection pattern included in each of the first and second conductor layers has a cutout part. At least a part of the outer peripheral end of the coil pattern included in each of the first and second conductor layers is disposed within the cutout part.