Coil Lead Pattern Thickness Layout for Electrode Defect Reduction
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Solution Overview
Problem
The existing coil components face issues with defect rates in the electrode portion, including plating bleeding and chipping defects, which affect DC resistance characteristics.
Innovation Solution
The coil component design includes a support substrate with a coil pattern and lead patterns on both surfaces, connected via a connection via penetrating through the substrate. The lead patterns are formed with a thickness smaller than the coil pattern, and the component is covered by a body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the lead pattern thickness is increased to reduce plating bleeding and chipping defects, then the manufacturing precision improves, but the DC resistance characteristics deteriorate due to increased material usage and potential overheating
Solution Approach 1:
The patent applies different thicknesses to different parts of the lead pattern structure. Specifically, the lead pattern has a first thickness in the region connected to the coil pattern and a second thickness in the region extending to the external electrode, where the second thickness is greater than the first. This local differentiation optimizes both defect reduction and electrical performance by providing sufficient thickness where mechanical strength is needed while maintaining thinner sections where electrical resistance is critical.
2Reliability
If the lead pattern thickness is decreased to improve DC resistance characteristics, then the reliability improves, but the manufacturing precision deteriorates due to increased susceptibility to plating bleeding and chipping defects
Solution Approach 1:
The patent implements a lead pattern with varying thickness where the first thickness (near coil connection) is optimized for electrical performance and the second thickness (near external electrode) is optimized for mechanical strength and defect prevention. This local quality differentiation allows each region to have the optimal thickness for its specific function, resolving the contradiction between electrical and mechanical requirements.
Solution Approach 2:
The lead pattern is segmented into distinct thickness regions - a first thickness region connected to the coil pattern and a second thickness region extending to the external electrode. This segmentation allows independent optimization of each region's thickness to meet different functional requirements, with the thicker second region providing mechanical robustness and the thinner first region providing low electrical resistance.
3Device complexity
If the coil pattern and lead pattern have the same thickness to simplify manufacturing, then the device complexity decreases, but the manufacturing precision deteriorates due to uniform thickness not optimizing for both defect reduction and electrical performance
Solution Approach 1:
The patent employs local quality by specifying that the lead pattern has different thicknesses in different regions - a first thickness in the coil connection region and a second thickness in the external electrode region. This approach maintains relatively simple overall structure while achieving optimized performance through localized thickness variation, balancing manufacturing simplicity with defect reduction.
Data Source
AI summary
A coil component includes: a support substrate; a coil portion including a coil pattern disposed on the support substrate, lead patterns disposed on both surfaces of the support substrate and connected to the coil pattern, and a connection via penetrating through the support substrate to connect the lead patterns disposed on the both surfaces of the support substrate to each other; and a body covering the support substrate and the coil portion, wherein any one of the lead patterns disposed on the both surfaces of the support substrate has a thickness smaller than that of the coil pattern.