Embedded Coil Lead-Out Structure for Stronger Body Coupling

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Solution Overview

Problem

The increasing demand for smaller, higher-performance electronic devices has led to a challenge in securing reliable coupling between coil components and their bodies, particularly due to the insulating films used, which can reduce the coupling force between lead-out patterns and the body.

Innovation Solution

A coil component design featuring a body with embedded support substrates and lead-out patterns, where anchor portions and protrusions increase the contact area between the lead-out patterns and the body, enhancing coupling reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an insulating film is interposed between the coil and the body for electrical insulation, then electrical insulation is improved, but coupling force between the lead-out pattern and the body is reduced

Engineering Contradiction:
Improveelectrical insulationVSAvoidcoupling force
Core Design Contradiction:
ReliabilityVSForce

Solution Approach 1:

The patent applies different properties to different parts of the lead-out pattern: the first lead-out pattern has direct contact with the body for strong coupling, while the second lead-out pattern has insulating film coverage for electrical insulation. This local differentiation resolves the contradiction between coupling force and electrical insulation.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The lead-out pattern is divided into two separate patterns: a first lead-out pattern that provides mechanical coupling without insulating film, and a second lead-out pattern that provides electrical insulation with insulating film. This segmentation allows each part to fulfill its specific function without compromising the other.

Inventive Principle:
Principle #1Segmentation

2Area of stationary object

If the area occupied by the lead-out pattern increases, then electrical connection area is improved, but coupling force is reduced due to insulating film

Engineering Contradiction:
Improvelead-out pattern areaVSAvoidcoupling force
Core Design Contradiction:
Area of stationary objectVSForce

Solution Approach 1:

The patent selectively applies insulating film to only the second lead-out pattern while leaving the first lead-out pattern exposed for direct contact. This allows the total lead-out area to be large for good electrical connection, while the critical coupling area remains free of insulating film.

Inventive Principle:
Principle #3Local quality

3Volume of moving object

If the size of the coil component is decreased, then device miniaturization is improved, but coupling reliability becomes more difficult to secure

Engineering Contradiction:
Improvecoil component sizeVSAvoidcoupling reliability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

By segmenting the lead-out pattern into two functional parts, the patent ensures that coupling reliability is maintained through the first lead-out pattern's direct contact, even as the overall component size is reduced for miniaturization.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11923124B2Coil component
Publication Date: 2024.03.05 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11923124B2 patent drawing
  • US11923124B2 patent drawing
  • US11923124B2 patent drawing

AI summary

A coil component includes a body having one surface, and one end surface and the other end surface, respectively connected to the one surface and opposing each other, a support substrate embedded in the body, and a coil portion disposed on the support substrate and including first and second lead-out patterns respectively exposed from surfaces of the body. The first lead-out pattern is exposed from the one surface of the body and the one end surface of the body. The second lead-out pattern is exposed from the one surface of the body and the other end surface of the body. The body includes an anchor portion disposed in each of the first and second lead-out patterns.