Embedded Lead-Out Structure in Coil Components for Connection Rigidity

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Solution Overview

Problem

As electronic devices become more multifunctional and miniaturized, thinned coil components face challenges with external forces applied to the connection area between the coil portion and external electrodes, leading to reduced connection reliability and structural rigidity.

Innovation Solution

The coil electronic component design includes an insulating substrate with a coil portion embedded in a body, featuring lead-out portions and protrusions that are connected and spaced apart from the external surface, enhancing mechanical adhesion and structural rigidity through a magnetic material structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the coil component is thinned to reduce size, then miniaturization is achieved, but connection reliability and structural rigidity deteriorate due to external forces applied to the connection area

Engineering Contradiction:
Improvecomponent sizeVSAvoidconnection reliability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent extends the lead-out portion in the thickness direction (vertical dimension) to create a protrusion that penetrates into the body. This dimensional extension increases the connection area and depth without increasing the planar footprint, thereby maintaining connection reliability while achieving miniaturization in the horizontal dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The protrusion structure is nested within the body, with the lead-out portion extending into the body's thickness direction. This nested configuration allows the connection structure to be embedded within the component volume, achieving enhanced mechanical adhesion without increasing overall component size.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Volume of moving object

If the coil component is thinned to reduce size, then miniaturization is achieved, but structural rigidity deteriorates due to external forces applied to the connection area

Engineering Contradiction:
Improvecomponent sizeVSAvoidstructural rigidity
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The lead-out portion is extended in the thickness direction to form a protrusion that penetrates into the body. This vertical extension creates a deeper mechanical interlock that resists external forces and maintains structural rigidity without increasing the component's horizontal dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a composite structure where the lead-out portion (conductive material) is embedded in the body (magnetic material with insulating resin). This composite configuration provides both electrical conductivity and mechanical strength, enhancing structural rigidity while maintaining miniaturization.

Inventive Principle:
Principle #40Composite materials

3Volume of moving object

If external forces are applied to the connection area between coil portion and external electrodes, then miniaturization is enabled, but electrical resistance increases or open defects occur

Engineering Contradiction:
Improvecomponent sizeVSAvoidelectrical connection reliability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The lead-out portion is extended in the thickness direction to create a protrusion that penetrates into the body. This dimensional extension increases the connection depth and contact area, providing a more robust electrical pathway that resists external forces and prevents open defects while maintaining miniaturized horizontal dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The protrusion structure is designed in advance to protrude into the body before external forces are applied. This preliminary structural reinforcement ensures that the connection area is pre-strengthened to resist subsequent external forces, preventing electrical resistance increase or open defects.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11830654B2Coil electronic component
Publication Date: 2023.11.28 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11830654B2 patent drawing
  • US11830654B2 patent drawing
  • US11830654B2 patent drawing

AI summary

A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed to an external surface of the body, and a protrusion embedded in the body to be connected to the lead-out portion, and spaced apart from the external surface of the body and each of the coil portion.