Embedded Coil Lead-Out Structure for Uniform Electrode Plating
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Solution Overview
Problem
In coil components, forming external electrodes by plating can be challenging due to conductivity differences between the lead-out portions and the support substrate, leading to non-uniform thickness and manufacturing defects.
Innovation Solution
The coil component design includes lead-out patterns and auxiliary lead-out patterns on opposing surfaces, connected via penetrating through a support substrate, allowing for uniform plating of external electrodes by extending the plating layer to exposed surfaces of both patterns and reducing the thickness deviation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If external electrode is formed on the surface by plating, then external electrode coverage is achieved, but uniform thickness cannot be obtained due to conductivity difference between lead-out portion and support substrate
Solution Approach 1:
The patent applies local quality by creating an auxiliary lead-out pattern with different conductivity properties than the support substrate. This auxiliary pattern is specifically designed to have higher conductivity to match the lead-out portion, ensuring uniform plating thickness in the region where external electrodes are formed. The local modification of electrical properties resolves the conductivity mismatch problem without affecting the overall structure.
Solution Approach 2:
The auxiliary lead-out pattern acts as an intermediary element between the support substrate and the external electrode. It mediates the conductivity difference by providing a transition zone with appropriate electrical properties, allowing the plating process to achieve uniform thickness. This intermediary structure bridges the gap between the low-conductivity support substrate and the high-conductivity lead-out portion.
2Productivity
If plating is performed on mixed conductivity surfaces, then external electrode formation is achieved, but plating time increases and manufacturing defects occur
Solution Approach 1:
By creating a localized auxiliary lead-out pattern with optimized conductivity in the specific region where plating occurs, the patent enables uniform plating deposition. This local quality improvement ensures that the plating process completes in appropriate time without generating defects such as uneven thickness or poor adhesion, thereby simultaneously improving productivity and reliability.
3Strength
If lead-out portion and support substrate have different conductivity, then structural integrity is maintained, but external electrode uniformity deteriorates
Solution Approach 1:
The patent maintains structural integrity by preserving the original support substrate while adding a localized auxiliary lead-out pattern. This auxiliary pattern is strategically positioned to affect only the plating region, providing the necessary conductivity match without compromising the overall structural design and mechanical strength of the component.
Solution Approach 2:
The lead-out structure is segmented into the original lead-out portion connected to the support substrate and an auxiliary lead-out pattern. This segmentation allows the auxiliary pattern to have different electrical properties optimized for plating, while the main support substrate maintains its structural function with original material properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the formation of external electrodes with a relatively uniform thickness, reducing manufacturing defects and shortening the plating time, while maintaining the structural integrity of the coil component.
Implementation Method 1
a connection via penetrating through the support substrate to connect the lead-out pattern and the auxiliary lead-out pattern to each other
Implementation Method 2
When the external electrode is formed on the surface of the body by plating
Data Source
AI summary
A coil component includes a coil portion embedded in a body, first and second lead-out portions connection to both end of the coil portion, respectively, and exposed from one surface of the body to be spaced apart from each other, and a support substrate supporting the coil portion and the first and second lead-out portions, and exposed from the one surface of the body. Each of the first and second lead-out portions includes a lead-out pattern and an auxiliary lead-out pattern disposed on one surface and the other surface of the support substrate, opposing each other, and exposed from the one surface of the body, respectively, and a connection via penetrating through the support substrate to connect the lead-out pattern and the auxiliary lead-out pattern to each other, and exposed from the one surface of the body.