Coil Component Leg Protrusion for Inductor Solder Wetting Control
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Solution Overview
Problem
In the miniaturization of electronic components, such as inductors, the bonding process to mounting bodies like printed wiring boards often results in impaired inductor function due to excessive wetting and spreading of solder, leading to reduced bonding strength and increased risk of mechanical breakage.
Innovation Solution
The coil component features leg portions with inward protrusions and inclined surfaces that suppress solder wetting, combined with a large electrode area and curved intersecting portions to enhance bonding strength and reliability, while maintaining the inductor's functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the inductor is miniaturized to meet compact device requirements, then the size of the inductor is reduced, but the bonding strength decreases and mechanical breakage risk increases due to excessive solder wetting
Solution Approach 1:
The leg portion is designed with non-uniform cross-sectional area, creating a protrusion with a smaller cross-sectional area than the main body. This local variation in geometry concentrates the solder joint at the protrusion tip, improving bonding strength at the critical mounting interface while maintaining overall component miniaturization
Solution Approach 2:
The invention introduces a vertical dimension to the leg portion by creating a protrusion that extends beyond the main body plane. This three-dimensional structure allows the solder to wet and bond at the protrusion tip, effectively increasing the bonding interface area and strength without increasing the horizontal footprint of the component
2Volume of moving object
If the inductor is miniaturized, then the size is reduced, but the risk of mechanical breakage increases due to excessive solder wetting
Solution Approach 1:
The non-uniform cross-sectional area creates a localized protrusion structure that controls solder flow and wetting behavior. The smaller cross-sectional area at the protrusion concentrates the bonding stress, preventing excessive solder from spreading into the main body and causing mechanical damage
Solution Approach 2:
The protrusion structure预先 (in advance) prevents excessive solder wetting by providing a geometric barrier. The smaller cross-sectional area at the protrusion tip limits the volume of solder that can wet the leg portion, thereby preventing the harmful effect of excessive solder spread before it occurs
3Volume of moving object
If the cross-sectional area of the leg portion is reduced for miniaturization, then the component size is reduced, but the bonding strength decreases
Solution Approach 1:
By introducing a vertical protrusion dimension, the invention compensates for the reduced horizontal cross-sectional area. The solder bonds at the protrusion tip, creating a strong localized joint that offsets the smaller overall leg portion dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents solder from impairing the inductor's function, increases bonding strength, and reduces the risk of mechanical failure, thereby enhancing the reliability and performance of the inductor during mounting.
Implementation Method 1
each of the leg portions includes a protrusion which protrudes inward with respect to a joint between the core and the leg portion... suppress solder wetting
Data Source
AI summary
There is provided a coil component which includes a core; and a plurality of leg portions provided at respective ends of the core, wherein each of the leg portions includes a protrusion which protrudes inward with respect to a joint between the core and the leg portion.