Coil Member Plating Pattern Thickness for Laser Cutting Reliability
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Solution Overview
Problem
Conventional coil members for camera modules suffer from reliability issues due to protruding plating lines after cutting, which can lead to corrosion and defects when coupled to printed circuit boards, as the substrate and plating lines have different laser absorption rates, causing uneven removal and exposure of plating lines.
Innovation Solution
The coil member is designed with a thinner plating pattern than the wiring pattern, allowing for controlled laser cutting to minimize substrate removal and reduce the protrusion length of the plating pattern, thereby preventing corrosion and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plating process is required when forming electrodes of each coil member, then electrical conductivity is improved, but plating lines protrude from the substrate after cutting
Solution Approach 1:
The patent changes the thickness parameter of the plating pattern to be smaller than the wiring pattern thickness. This parameter modification ensures that when laser cutting is performed, the plating pattern is removed more completely than the substrate, preventing protrusion while maintaining electrical conductivity functionality.
Solution Approach 2:
The patent applies different thickness characteristics to different parts of the conductive pattern. Specifically, the plating pattern (used for electrical connection) has a different thickness than the wiring pattern (used for electromagnetic coil function). This local differentiation allows the plating pattern to be selectively removed during laser cutting while preserving the substrate structure.
2Productivity
If laser cutting is performed to separate coil members, then individual coil members are obtained, but substrate and plating lines are removed unevenly due to different laser absorption rates
Solution Approach 1:
The patent modifies the thickness parameter of the plating pattern to create a thickness difference between the plating pattern and the substrate. This parameter change exploits the different laser absorption rates of the materials, ensuring that the thinner plating pattern is removed more efficiently during laser cutting, achieving uniform cutting results.
Solution Approach 2:
The patent prepares the plating pattern with a predetermined thinner thickness before the laser cutting process. This preliminary action ensures that when laser cutting is performed to separate individual coil members, the plating pattern is already positioned to be removed more completely than the substrate, preventing protrusion issues.
3Reliability
If plating lines protrude from the substrate, then electrical connection is maintained, but corrosion occurs and reliability deteriorates
Solution Approach 1:
The patent changes the thickness parameter of the plating pattern to be smaller than the wiring pattern. This ensures that after laser cutting, the plating pattern does not protrude from the substrate surface, eliminating the exposed surfaces that would be susceptible to corrosion while maintaining the electrical connection function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes the length of the plating pattern protruding from the substrate, improving the appearance and reliability of the coil member by reducing corrosion risks and preventing defects during integration with printed circuit boards.
Implementation Method 1
when cutting with a laser along a cutting line of the coil member region, an intensity or irradiation time of the laser may be greater than that of other regions in order to remove the plating pattern in a region where the plating pattern is disposed on the substrate
Implementation Method 2
since the substrate and the plating line of the coil member have different laser absorption rates, the plating line may protrude to the outside of the substrate as the substrate around the plating line is removed together
Data Source
AI summary
A coil member, according to an embodiment, comprises: a substrate comprising a first surface and a second surface that is opposite to the first surface; a wiring pattern disposed on the substrate; and a metal coating pattern which is connected to the wiring pattern, the metal coating pattern being thinner than the wiring pattern.