Coil Module Columnar Conductors Heat Resistance
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Solution Overview
Problem
Existing coil modules face challenges in heat-resistant properties and joint strength due to reduced thickness of wiring films and conductors, and difficulties in positioning conductors, especially in high-temperature environments, where solder reliability decreases and conductor thickness affects fixing strength.
Innovation Solution
A coil module structure featuring columnar conductors standing on a resin substrate with exposed ends, connected via conductive layers on the substrate and sealing resin layer, eliminating the need for solder and allowing for improved heat resistance and fixing strength, while preventing solder splash and enabling smaller module sizes and increased conductor lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solder is used to join wiring films and upper wiring conductors, then joint strength can be obtained, but heat resistant properties deteriorate in high-temperature environments
Solution Approach 1:
The patent changes the joining method from solder-based to conductive paste or plating-based, fundamentally altering the material parameters and joining mechanism to eliminate temperature limitations associated with solder melting points
Solution Approach 2:
The patent replaces expensive, temperature-limited solder with more robust, temperature-resistant conductive paste or plating materials that can withstand high-temperature environments without degrading
2Volume of moving object
If thicknesses of wiring films and upper wiring conductors are reduced to reduce module size, then module size decreases, but joint strength becomes insufficient
Solution Approach 1:
The patent changes the joining method from solder-based to conductive paste or plating-based, which provides superior joint strength that does not depend on the thickness of the wiring films or conductors, enabling thin-film designs without compromising joint integrity
Solution Approach 2:
The patent replaces the mechanical solder joint system with a conductive paste or plating-based bonding system that achieves stronger adhesion through chemical bonding and surface adhesion mechanisms rather than purely mechanical interlocking
3Ease of manufacture
If upper wiring conductors are joined to wiring films, then coil electrode can be formed, but positioning becomes difficult due to falling or tilting
Solution Approach 1:
The patent applies conductive paste or plating to the wiring films before placing the upper wiring conductors, creating a pre-formed bonding surface that secures the conductors in their correct positions and prevents falling or tilting during assembly
Solution Approach 2:
The patent introduces conductive paste or plating as an intermediary material between the wiring films and upper wiring conductors, which acts as an adhesive mediator that bonds the two components together while maintaining precise positioning
Data Source
AI summary
A coil module includes a substrate layer, a coil electrode, and a sealing resin layer. The coil electrode includes metal pins that stand on a resin substrate of the substrate layer in such a way that lower end surfaces thereof are exposed on a lower surface of the substrate layer. The sealing resin layer is stacked on the substrate layer and covers the metal pins. Upper end surfaces of the metal pins are exposed on an upper surface of the sealing resin layer. Each of the metal pins and a corresponding one of the metal pins paired therewith are connected to each other on the lower surface of the substrate layer through a lower wiring pattern. Each of the pins and a corresponding one of the metal pins are connected to each other on the upper surface of the substrate layer through an upper wiring pattern.