Coil Module Dual Induction Substrates Wireless Charging
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Solution Overview
Problem
Existing wireless charging and communication coil modules fail to meet requirements for improved charging performance, communication performance, reduced thickness, and electromagnetic interference reduction.
Innovation Solution
A coil module design featuring a coil assembly with induction substrates and adhesive elements, where the substrates have specific crack orientations and recesses, and adhesive assemblies to enhance electromagnetic field concentration and mechanical strength, while minimizing thickness and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a magnetically conductive substrate is used to support the coil, then magnetic field concentration is improved, but device thickness increases
Solution Approach 1:
The patent divides the induction substrate into two separate layers (first induction substrate and second induction substrate) with the coil assembly positioned between them. This segmentation allows each substrate layer to be optimized for magnetic field concentration while distributing the overall thickness, resolving the contradiction between achieving good charging performance and reducing module thickness.
2Ease of manufacture
If traditional coil winding methods are used, then manufacturing simplicity is maintained, but charging and communication performance are insufficient
Solution Approach 1:
The patent introduces specific structural features at local positions: accommodating recesses in the induction substrates and corresponding protrusions on the coil assembly. This local quality enhancement optimizes the magnetic field distribution and mechanical coupling at critical interfaces, significantly improving charging and communication performance while maintaining overall manufacturing feasibility.
3Device complexity
If single-layer induction substrate is used, then structure simplicity is maintained, but electromagnetic interference is reduced
Solution Approach 1:
The patent employs a dual-layer induction substrate structure with the coil assembly positioned between them. This segmentation creates a more effective magnetic field containment system, where the two substrate layers work together to confine and direct magnetic flux, thereby reducing electromagnetic interference while maintaining reasonable structural complexity.
4Ease of manufacture
If adhesive element covers both substrates on the same plane, then manufacturing simplicity is maintained, but mechanical strength and heat dissipation are insufficient
Solution Approach 1:
The patent positions the adhesive element in a different spatial arrangement - covering the first induction substrate and extending to cover the second induction substrate at a different plane/level. This dimensional change in adhesive placement creates better mechanical interlocking and improves heat dissipation pathways while remaining compatible with manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves mechanical strength, charging efficiency, heat dissipation, miniaturization, and reduces electromagnetic interference, achieving better performance and efficiency in wireless energy and signal transmission.
Implementation Method 1
The adhesive element covers the first induction substrate and the second induction substrate
Implementation Method 2
the wireless charging receiving terminal in the electronic device generates current by electromagnetic induction or electromagnetic resonance to charge the battery
Implementation Method 3
the magnetically conductive substrate can concentrate the magnetic lines of force emitted from the coil for better performance
Data Source
AI summary
A coil module includes a coil assembly, a first induction substrate, a second induction substrate and an adhesive element. The coil assembly has a winding axis. The coil assembly is disposed on the first induction substrate. The first induction substrate is disposed on the second induction substrate. The adhesive element covers the first induction substrate and the second induction substrate, and the adhesive element has a first adhesive portion and a second adhesive portion. When viewed in a direction perpendicular to the winding axis, the first adhesive portion and the second adhesive portion are located on different planes.