Coil Module Design Using Segmented Electrodes
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Solution Overview
Problem
The existing coil module manufacturing processes are costly and complex, particularly due to the need for specialized processes to form coil electrodes on both surfaces of the insulating layer, which increases the cost and complexity of the wiring substrate.
Innovation Solution
A coil module design where the component-side coil electrode is embedded in the insulating layer with a non-helical shape, and the substrate-side coil electrode is formed on the wiring substrate using common substrate forming techniques, allowing for a simplified manufacturing process and reduced costs by eliminating the need for specialized processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If coil electrodes are formed on both surfaces of the insulating layer using specialized processes, then the coil electrode structure is achieved, but the manufacturing cost and complexity increase
Solution Approach 1:
The coil electrode is divided into two separate parts: a component-side coil electrode formed on the insulating layer and a substrate-side coil electrode formed on the wiring substrate. This segmentation allows each part to be manufactured using appropriate processes independently, then connected together, thereby reducing overall manufacturing complexity while achieving the required helical coil structure.
2Manufacturing precision
If specialized processes are used to form coil electrodes, then the coil structure is achieved, but the manufacturing cost increases
Solution Approach 1:
The component-side coil electrode and substrate-side coil electrode are merged through connection to form the complete helical coil structure. This merging approach allows the use of cost-effective manufacturing processes for each separate electrode, avoiding the need for expensive specialized processes to form the entire coil in one step.
3Area of stationary object
If the substrate-side coil electrode is formed close to the coil core, then the wiring substrate area is reduced, but stress on the coil increases
Solution Approach 1:
The distance between the substrate-side coil electrode and the coil core is optimized to provide adequate spacing that reduces mechanical stress on the coil while still achieving compact overall dimensions. This local quality adjustment ensures the coil operates under reduced stress conditions without excessively increasing the substrate area.
Data Source
AI summary
A coil component is provided with only first and second columnar conductors that are a part of a coil electrode. This can simplify the manufacturing process and reduce the cost of the coil component. A wiring substrate is provided with substrate-side wiring electrode traces that form the remaining part of the coil electrode. In the process of forming the wiring substrate using a substrate forming technique commonly used, the substrate-side wiring electrode traces can be easily formed together with other wiring electrodes. Therefore, when the coil electrode is configured to be formed by placing the coil component on the wiring substrate, a coil module including the coil component can be inexpensively manufactured.