Coil-Incorporated Multilayer Substrate Resin Flow Deformation
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Solution Overview
Problem
Conductor patterns in coil-incorporated multilayer substrates made of thermoplastic resin tend to deform during manufacturing due to resin flow, leading to unstable electrical characteristics.
Innovation Solution
The use of conductor patterns with specific width relationships and dummy patterns, connected to interlayer connection conductors, to fix and prevent resin flow, thereby reducing deformation and stabilizing electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a base material made of thermoplastic resin is stacked in plural to configure a stacked body, then the base material can be simultaneously molded by thermally pressing without using an adhesive layer, but the resin flows during thermal pressing causing conductor pattern deformation
Solution Approach 1:
The conductor patterns are designed with predetermined width variations before thermal pressing. The outermost and innermost conductor patterns are made wider than the intermediate patterns, creating a structure that proactively resists resin flow during the subsequent thermal pressing process, thereby preventing deformation before it occurs
Solution Approach 2:
Different portions of the conductor pattern are given different widths to serve different functions. The outermost and innermost patterns have larger widths to anchor and restrain resin flow, while intermediate patterns have smaller widths appropriate for their electrical function, creating local structural variations that solve the overall deformation problem
2Manufacturing precision
If the conductor pattern width is increased to prevent resin flow deformation, then pattern stability improves, but the coil area and electrical characteristics may be affected
Solution Approach 1:
The conductor pattern width is optimized locally rather than uniformly across the entire pattern. Only the outermost and innermost patterns have increased widths for stabilization purposes, while intermediate patterns maintain appropriate widths for electrical performance, thus achieving both stability and electrical reliability
Solution Approach 2:
Instead of increasing the width of all conductor patterns, the invention applies width increase only to the extent necessary - specifically to the outermost and innermost patterns that provide the anchoring effect against resin flow. This partial application of the width increase principle achieves the stabilization goal while minimizing impact on coil area and electrical characteristics
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces or prevents conductor pattern deformation caused by resin flow, stabilizing the electrical characteristics of the coil and enhancing manufacturing efficiency.
Implementation Method 1
thermally pressing the plurality of base materials
Implementation Method 2
base material made of thermoplastic resin and including the conductor pattern
Data Source
AI summary
A coil-incorporated multilayer substrate includes base materials and a coil portion including conductor patterns that are wound a plurality of times on at least one of the base materials, and, in a predetermined direction along the surface of the base material of the coil portion, the width of outermost conductor patterns is larger than the widths of the conductor patterns between an innermost conductor pattern and an outermost conductor pattern, the width of the innermost conductor pattern is larger than the widths of the conductor patterns between the outermost conductor pattern and the innermost conductor pattern, and the width of the innermost conductor pattern is larger than the distance between the innermost conductor pattern and the conductor pattern adjacent to the innermost conductor pattern.