Magnetic Coil Component Packing With Bimodal Particle Structure

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Solution Overview

Problem

Existing coil components face challenges in achieving a high filling factor for metal magnetic particles, which is essential for enhancing magnetic permeability and reducing eddy current losses, due to limitations in the distribution and deformation of particles during the compression molding process.

Innovation Solution

The use of a combination of first and second metal magnetic particles with different average particle sizes and deformation strengths, where the second particles with higher deformation strength are arranged to form depressions on the surface of the first particles, allowing for improved packing and reduced gaps between them, thereby enhancing the filling factor during compression molding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If metal magnetic particles are packed densely to improve filling factor, then magnetic permeability is enhanced, but gaps and voids between particles increase during compression molding

Engineering Contradiction:
Improvefilling factorVSAvoidparticle distribution uniformity
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent changes the particle size parameter by using a bimodal distribution with two distinct size groups (first group with larger particles, second group with smaller particles). This parameter change allows smaller particles to fill the interstices between larger particles, increasing the overall filling factor while maintaining uniform distribution during compression molding.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite particle system combining two different metal magnetic particle sizes. This composite approach leverages the geometric advantage of size differentiation, where the smaller particles effectively occupy the void spaces between larger particles, achieving higher density packing and improved filling factor without compromising manufacturing precision.

Inventive Principle:
Principle #40Composite materials

2Quantity of substance

If compression molding pressure is increased to improve particle packing, then filling factor increases, but insulating film integrity is compromised leading to short circuits

Engineering Contradiction:
Improvefilling factorVSAvoidinsulating film integrity
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent changes the particle size parameter to include a smaller second group of particles that can pack into interstices. This reduces the overall compression pressure needed to achieve high filling factor, thereby protecting the insulating films from damage while still achieving dense packing through the size-differentiated particle arrangement.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The smaller second group particles preliminarily occupy the interstitial spaces between larger first group particles before final compression. This preliminary arrangement reduces the void volume that would otherwise require high compression pressure to eliminate, thereby protecting insulating films from excessive stress during molding.

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If single size metal magnetic particles are used to simplify manufacturing, then ease of manufacture is improved, but filling factor and magnetic permeability are reduced

Engineering Contradiction:
Improveparticle mixing simplicityVSAvoidfilling factor
Core Design Contradiction:
Ease of manufactureVSQuantity of substance

Solution Approach 1:

The patent changes the particle size parameter by introducing a bimodal distribution with two size groups. While this adds complexity to the particle mixture, it significantly improves the filling factor by allowing smaller particles to occupy void spaces between larger particles, thereby enhancing magnetic permeability despite the increased manufacturing complexity.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite particle system with two size groups. This composite structure improves filling factor and magnetic performance by utilizing the geometric advantage of size differentiation, where smaller particles fill the gaps between larger particles, overcoming the limitations of monodisperse particle systems.

Inventive Principle:
Principle #40Composite materials

4Ease of manufacture

If larger metal magnetic particles are used to reduce manufacturing complexity, then ease of manufacture is improved, but magnetic permeability and filling factor decrease

Engineering Contradiction:
Improveparticle processing simplicityVSAvoidfilling factor
Core Design Contradiction:
Ease of manufactureVSQuantity of substance

Solution Approach 1:

The patent changes the particle size parameter by incorporating a bimodal distribution. Instead of using only large particles for manufacturing simplicity, it combines large first group particles with smaller second group particles, achieving high filling factor through efficient space utilization while maintaining manageable manufacturing processes.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite particle system combining large and small metal magnetic particles. This composite structure overcomes the limitation of using only large particles by allowing smaller particles to fill interstitial voids, thereby significantly improving filling factor and magnetic permeability while maintaining ease of manufacture through standardized particle production processes.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS11996221B2Coil component, circuit board, and electronic device
Publication Date: 2024.05.28 TAIYO YUDEN KK
  • US11996221B2 patent drawing
  • US11996221B2 patent drawing
  • US11996221B2 patent drawing

AI summary

A coil component relating to one embodiment of the present invention includes a base body, a coil conductor provided in the base body, and first and second external electrodes electrically connected to the coil conductor. The base body contains a first group of metal magnetic particles having a first average particle size and a second group of metal magnetic particles having a second average particle size smaller than the first average particle size. The first group of metal magnetic particles includes first metal magnetic particles, and the second group of metal magnetic particles includes second metal magnetic particles, and each second metal magnetic particle has an insulating film formed on a surface thereof. Each first metal magnetic particle has a depression shaped to conform to a part of the surface of an adjacent one of the second metal magnetic particles.