Coil Conductor Photopatterning for Flat Multilayer Coil Surfaces
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Solution Overview
Problem
Existing coil component manufacturing methods face challenges in maintaining a flat forming surface while minimizing the number of steps, leading to increased complexity and potential deformities in coil conductors.
Innovation Solution
A method involving the sequential application and exposure of photosensitive conductive pastes to form curing patterns, followed by development and the addition of insulating materials, which reduces the number of steps and maintains a flat forming surface, allowing for high aspect ratio coil conductor formation without the need for additional processing steps like pressing or forming terminal electrodes separately.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a thick insulating paste is used to fill the step in the forming surface, then the forming surface can be kept flat, but the number of steps increases
Solution Approach 1:
The patent combines multiple functions into the insulating paste layer: it serves as both the insulating layer and the filling material for steps. By applying insulating paste over the entire surface including step regions and then performing planarization in a single step, the method eliminates the need for separate filling operations, thereby reducing the total number of manufacturing steps while maintaining surface flatness
Solution Approach 2:
The patent applies the insulating paste layer before the final planarization step, covering the step regions in advance. This preliminary application allows the subsequent planarization to simultaneously fill steps and create a flat surface, avoiding the need for separate filling operations and reducing overall process complexity
2Manufacturing precision
If multiple separate steps are used to form different coil conductors, then precise patterning can be achieved, but the number of steps increases and surface flatness is compromised
Solution Approach 1:
The patent combines the formation of multiple coil conductors with different shapes into a single photolithography and development process. By applying a unified photosensitive paste layer and using a mask with multiple patterns, all coil conductor patterns are formed simultaneously in one step, maintaining precise patterning while significantly reducing the number of manufacturing steps compared to sequential formation methods
Solution Approach 2:
The photosensitive paste layer serves multiple functions: it defines patterns for different coil conductors with different shapes, provides insulation between conductors, and maintains surface flatness. This multi-functional approach eliminates the need for separate processing steps for each coil conductor, reducing overall process complexity while maintaining manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces the risk of coil conductor deformation, and enhances magnetic properties by minimizing residual stress, while also preventing electrical short circuits between coil conductors.
Implementation Method 1
applying a first photosensitive conductive paste on a substrate and exposing the first photosensitive conductive paste to light with a pattern corresponding to the first coil conductor to form a first curing pattern
Implementation Method 2
developing portions of the first photosensitive conductive paste and the second photosensitive conductive paste that were not exposed
Data Source
AI summary
A method for manufacturing a coil component including an element body, and a coil disposed inside the element body and including a first coil conductor and a second coil conductor having different shapes, the method comprises: applying a first photosensitive conductive paste on a substrate and exposing the first photosensitive conductive paste to light with a pattern corresponding to the first coil conductor to form a first curing pattern; after the forming of the first curing pattern, applying a second photosensitive conductive paste on the first photosensitive conductive paste and exposing the second photosensitive conductive paste to light with a pattern corresponding to the second coil conductor to form a second curing pattern; after the forming of the second curing pattern, developing portions of the first photosensitive conductive paste and the second photosensitive conductive paste that were not exposed; and after the developing, adding an insulating material on the substrate.