Coil Device Recessed Electrode Prevents Short Circuit
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Solution Overview
Problem
Conventional coil devices with vertical drum cores face issues of short circuits due to electrode contact with the coil and solder fillet overflow, leading to mounting strength and reliability concerns.
Innovation Solution
The coil device incorporates a recessed electrode design on the flange's circumference surface, creating a spaced separation from the coil and inner flange surfaces to prevent short circuits and ensure proper solder fillet formation, with a thinner electrode thickness towards the center and inner flange to reduce contact risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the electrode is formed to extend over the outer end surface and circumference surface of the flange, then the mounting strength is improved, but the risk of short circuit between the electrode and coil increases
Solution Approach 1:
The electrode is designed with non-uniform thickness, being thicker at the outer end surface for mounting strength and thinner at the circumference surface to prevent short circuits. This local variation in electrode properties resolves the contradiction between mounting strength and short circuit prevention.
Solution Approach 2:
The electrode extends in multiple dimensions: radially outward to the outer end surface and circumferentially along the flange. This multi-dimensional extension allows the electrode to provide both mounting strength (radial extension) and controlled proximity to the coil (circumferential extension with reduced thickness), resolving the contradiction through spatial dimensionality.
2Manufacturing precision
If the electrode is formed to the circumference surface of the flange, then the solder fillet formation is improved, but the solder fillet may overflow onto the inner end surface and contact the coil
Solution Approach 1:
The electrode thickness is locally reduced at the circumference surface where solder fillet formation occurs. This thinner section allows proper solder fillet formation while the reduced thickness prevents solder overflow onto the inner end surface, thereby preventing short circuits between the solder and coil.
Solution Approach 2:
The reduced-thickness electrode section acts as an intermediary barrier between the solder fillet and the coil. It allows the solder fillet to form properly on the electrode surface while preventing the solder from reaching the coil, thus mediating between manufacturing requirements and electrical isolation.
3Volume of moving object
If the electrode is positioned closer to the coil for compact design, then the device size is reduced, but the risk of contact and short circuit increases
Solution Approach 1:
The electrode exhibits local quality variations in thickness, being thinner at the circumference surface where proximity to the coil creates short circuit risk. This allows compact device design with the electrode close to the coil while maintaining electrical isolation through the reduced thickness section.
Solution Approach 2:
The electrode thickness parameter is changed locally at the circumference surface to a smaller value. This parameter change allows the electrode to be positioned closer to the coil for compact design while the reduced thickness parameter prevents short circuits, resolving the contradiction between size and reliability.
Data Source
AI summary
A coil device 10 including a core having a core center part 23 for disposing roughly perpendicularly to a mounting surface and a flange 22 formed to one end in an axial direction of the core center part 23; a coil 30 disposed around the core center part 23; andan electrode 40 connected to a lead part 30a of the coil 30 and formed at least partially to a circumference surface of the flange 22; whereinthe electrode 40 on the circumference surface of the flange 22 has a recessed part 420 which is recessed from an edge of the electrode 40 towards an outer end surface 221 of the flange 22.