Coil Sheet Cutting with Movable Piece Collection Under the Cutting Plane
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Solution Overview
Problem
Existing laser or plasma cutting technologies for laminar material wound in coil fail to separate machined pieces from swarf and skeleton directly in the cutting area, leading to increased device size and potential deformations or abrasions of machined pieces.
Innovation Solution
An apparatus with a movable device for selective collection of machined pieces, controlled by an electronic unit to coordinate cutting operations, allowing separation of machined pieces from swarf and skeleton directly in the cutting area, using a conveyor belt to collect pieces without interfering with swarf fall and minimizing deformation risk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a spike bed conveyor is used to support laminar material during cutting, then the material is prevented from burning at contact points, but the machined pieces cannot be separated from swarf and skeleton directly in the cutting area
Solution Approach 1:
The patent applies the dynamics principle by making the conveyor belt movable rather than stationary. The conveyor belt can be positioned in different locations: during cutting it supports the material to prevent burning, and after cutting it can be moved to allow pieces to separate from the skeleton. This dynamic repositioning resolves the contradiction between needing support during cutting and needing separation capability afterward.
2Manufacturing precision
If pieces are completely cut in the cutting station, then no micro-joints remain connecting pieces to skeleton, but an additional separation area downstream is required increasing device size
Solution Approach 1:
The patent merges the cutting function and separation function into a single cutting station. By making the conveyor belt movable, the same station can both perform complete cutting and facilitate separation of pieces from the skeleton, eliminating the need for a separate downstream separation area and reducing overall device size.
Solution Approach 2:
The cutting station is designed with multi-functionality, serving both as the cutting area and the separation area. The movable conveyor belt enables the station to adapt its configuration: supporting material during cutting, then repositioning to allow complete separation of pieces, thus making one station perform multiple functions.
3Ease of operation
If a discontinuity in the transport means is used to separate pieces from skeleton, then separation occurs automatically, but the machined pieces may be deformed during the falling process
Solution Approach 1:
The patent applies beforehand cushioning by having the conveyor belt continuously support the material and pieces throughout the process. Instead of allowing pieces to fall freely through a discontinuity, the movable conveyor belt maintains support and can be positioned to gently receive separated pieces, cushioning them against deformation while still enabling automatic separation.
4Productivity
If the conveyor belt is positioned close to the cutting plane, then piece collection is efficient, but the risk of deformations and abrasions increases
Solution Approach 1:
The patent applies dynamics by making the conveyor belt position adjustable rather than fixed. The belt can be dynamically positioned at optimal distances from the cutting plane depending on the operational phase: closer during collection for efficiency, and at a controlled distance during separation to minimize deformation risk, thus resolving the contradiction between collection efficiency and piece quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables compact apparatus design with direct separation of machined pieces from swarf and skeleton, reducing the risk of deformations and abrasions while maintaining efficient operation.
Implementation Method 1
laser or plasma cutting of pieces from laminar material wound in coil
Implementation Method 2
laser or plasma cutting of pieces from laminar material wound in coil
Implementation Method 3
letting said swarf fall into said receiving cavity
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
The present invention concerns an apparatus for laser or plasma cutting of pieces P from laminar material wound in coil, comprising: - a cutting station 10, provided with at least one cutting head 11 movable within an operative cutting area 12, located above a receiving cavity 13 for the cutting swarf T; - means 21, 22 for positioning a portion of the laminar material in the operative area on a cutting plane m located above the receiving cavity 13, wherein such positioning means are intended to keep the portion blocked on the cutting plane during cutting operations, suspended in the air and longitudinally stretched above the cavity; and - an electronic control unit 200. The apparatus comprises at least one movable device 100 for selective collection of the machined pieces P. The movable device 100 defines a continuous collection surface 101 and is movable underneath the cutting plane and parallel to it between an active position, wherein it is positioned inside the operative cutting area closing the cavity between the cutting plane and the bottom of the cavity, and a passive position, wherein it is positioned outside the operative cutting area outside the cavity. The electronic control unit is programmed to control the movement of said movable collection device 100 between the two positions in coordination with the execution of the cutting operations, in such a way that that the movable device is in the passive position when the cutting head is performing cutting operations that generate swarf T, letting such swarf free to fall by gravity inside the cavity 13, and is instead in the active position when the cutting head is performing cutting operations which lead to the complete detachment of the pieces P from the skeleton S so that such pieces P are collected by the movable device separately from the swarf T and from the skeleton, which is retained by the positioning means on the cutting plane m above the movable device 100.