Wireless Charging Coil Shield Layout for Higher Mutual Inductance
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Solution Overview
Problem
Current wireless charging systems face inefficiencies in power transmission due to limited mutual inductance between the transmitting and receiving coils, which affects the charging efficiency of semiconductor devices.
Innovation Solution
A conductive shield with an opening and channel region is integrated into the back-side shielding structure, enhancing the magnetic field interaction between the coils by inducing a secondary magnetic field that increases mutual inductance, thereby improving transmission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional back-side shielding structure is used, then the device structure is simple, but the mutual inductance between coils is limited and transmission efficiency is low
Solution Approach 1:
The conductive shield is segmented into multiple functional regions: a first conductive region, a second conductive region, and a third conductive region. These regions are spatially separated and configured to perform different functions in the magnetic field interaction, allowing optimized flux distribution without requiring a completely redesigned shield structure
Solution Approach 2:
Different regions of the conductive shield are designed with different properties: the first conductive region is positioned to receive magnetic flux from the transmitting coil, the second region is configured to induce secondary magnetic field, and the third region completes the flux path. This local differentiation optimizes the magnetic field interaction at each specific location while maintaining overall structural simplicity
2Reliability
If the conductive shield with multiple regions is implemented, then mutual inductance and transmission efficiency are improved, but the manufacturing process becomes more complex
Solution Approach 1:
The first, second, and third conductive regions are formed as an integrated conductive shield structure using a single deposition process. The regions are spatially distinct but structurally unified, allowing them to be manufactured together as one component rather than assembled from separate parts, thus maintaining ease of manufacture while achieving the desired functional differentiation
Solution Approach 2:
The conductive shield serves multiple functions simultaneously: it acts as a shielding element, a magnetic flux guide, and a secondary magnetic field generator. The same structure performs all these functions through its different regions, eliminating the need for additional separate components and simplifying the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances wireless power transmission efficiency by up to 2% by increasing mutual inductance between the transmitting and receiving coils, leading to more effective charging of semiconductor devices.
Implementation Method 1
A conductive shield with an opening and channel region is integrated into the back-side shielding structure, enhancing the magnetic field interaction between the coils by inducing a secondary magnetic field that increases mutual inductance
Data Source
AI summary
In an embodiment, a device includes: a conductive shield on a first dielectric layer; a second dielectric layer on the first dielectric layer and the conductive shield, the first and second dielectric layers surrounding the conductive shield, the second dielectric layer including: a first portion disposed along an outer periphery of the conductive shield; a second portion extending through a center region of the conductive shield; and a third portion extending through a channel region of the conductive shield, the third portion connecting the first portion to the second portion; a coil on the second dielectric layer, the coil disposed over the conductive shield; an integrated circuit die on the second dielectric layer, the integrated circuit die disposed outside of the coil; and an encapsulant surrounding the coil and the integrated circuit die, top surfaces of the encapsulant, the integrated circuit die, and the coil being level.