Coil Component Shielding Layer Design for EMI Reduction
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Solution Overview
Problem
Current coil components face challenges in reducing size and thickness while effectively forming electrode and shielding structures to minimize magnetic flux leakage, which is essential for high-performance electronic devices with increased component density and reduced size.
Innovation Solution
A coil component design featuring a body with opposing surfaces, a coil portion buried within, external electrodes, insulating layers, and integrated shielding layers that reduce magnetic flux leakage and allow for easy electrode formation on the lower surface, enabling efficient shielding and compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding can is used to envelop electronic components, then electromagnetic interference is reduced, but the size and thickness of the component increase
Solution Approach 1:
The shielding function is segmented from a separate shielding can and integrated into the coil component structure itself. The shielding layer is divided into multiple regions (first shielding region on the lower surface, second shielding region on the side surface) that work together to provide EMI protection without requiring an external enveloping can.
Solution Approach 2:
The shielding structure is merged with the coil component by forming the shielding layer as an integral part of the component assembly. The shielding layer is formed on the lower surface and side surface of the coil component, combining the functional elements into a single integrated structure that reduces overall size.
2Productivity
If the coil component size is reduced, then component density increases, but forming electrode structures on the lower surface becomes difficult
Solution Approach 1:
The electrode structure is formed by extending the connection electrode from the side surface to the lower surface of the coil component. This three-dimensional electrode arrangement allows terminals to be accessible from multiple dimensions, enabling easy mounting and connection while maintaining a compact footprint on the circuit board.
3Volume of moving object
If the coil component size is reduced, then space is saved, but forming an effective shielding structure becomes difficult
Solution Approach 1:
The shielding layer is nested within the overall component structure, with the first shielding region formed on the lower surface and the second shielding region formed on the side surface. This nested arrangement provides effective shielding coverage while maintaining a compact component footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a reduced size and thickness for coil components while effectively shielding magnetic flux leakage, enhancing performance and allowing for easier electrode formation, thus addressing the need for smaller, high-performance electronic components.
Implementation Method 1
a first shielding layer disposed on the external insulating layer
Data Source
AI summary
A coil component includes a body having one surface and the other surface opposing each other in one direction, and a plurality of walls each connecting the one surface to the other surface; a coil portion buried in the body, and having both ends exposing to one of the plurality of walls of the body; first and second external electrodes respectively including first and second terminal electrodes disposed on one surface of the body and spaced apart from each other, and first and second connection electrodes respectively connecting the first and second terminal electrodes to both ends of the coil portion; a first external insulating layer disposed on the other surface of the body; and a first shielding layer disposed on the external insulating layer.