Coil Component Shielding Layer Design for EMI Reduction
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Solution Overview
Problem
Current EMI shielding technologies for electronic components are ineffective in minimizing leakage magnetic flux, which can lead to electromagnetic interference issues in increasingly compact electronic devices.
Innovation Solution
A coil component design featuring a body with a coil pattern, an insulating layer, a shielding layer, and a seed layer, where the shielding layer is strategically positioned to reduce leakage magnetic flux, including a cap portion and sidewall portions on the body, and the seed layer penetrates into the insulating layer for enhanced adhesion and shielding effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield can surrounds the electronic components and board simultaneously, then EMI shielding is provided, but leakage magnetic flux is not minimized
Solution Approach 1:
The shielding structure is segmented into multiple functional layers: a first shielding layer (cap portion) covering the coil component, a second shielding layer (sidewall portions) extending along the board, and a magnetic shielding layer integrated into the board. This segmentation allows each layer to address specific leakage paths, effectively minimizing magnetic flux leakage while maintaining EMI shielding.
Solution Approach 2:
A magnetic shielding layer is introduced as an intermediary between the coil component and the board, and between adjacent components. This intermediate layer specifically targets and blocks magnetic flux leakage paths that the outer shield can does not address, resolving the contradiction between general EMI shielding and specific magnetic flux containment.
2Volume of moving object
If electronic device size is decreased, then device compactness is improved, but EMI shielding effectiveness is compromised
Solution Approach 1:
The shielding structure is nested within the existing device architecture: the first shielding layer is positioned over the coil component, the second shielding layer integrates with the board structure, and the magnetic shielding layer is embedded within the board itself. This nesting approach provides multi-layer EMI shielding and magnetic flux containment without adding significant external volume, maintaining device compactness while improving shielding effectiveness.
Solution Approach 2:
The shielding approach transitions from a single three-dimensional shield can to a multi-layer planar structure with vertical and horizontal components. The cap portion provides vertical shielding over the coil, while the sidewall portions extend horizontally along the board, creating a distributed shielding network that is more space-efficient than traditional volumetric shielding.
3Object-affected harmful factors
If shield can is used to surround components, then EMI shielding is achieved, but manufacturing complexity increases
Solution Approach 1:
The shielding structure is merged with existing manufacturing processes: the first and second shielding layers can be formed using standard PCB fabrication techniques, and the magnetic shielding layer is integrated into the board structure during board manufacturing. This merging eliminates the need for separate shield can assembly, reducing manufacturing complexity while maintaining shielding effectiveness.
Solution Approach 2:
The board structure itself serves dual purposes: it provides mechanical support for components and simultaneously functions as a magnetic shielding layer. The board's ground planes and metallic layers are configured to provide magnetic flux containment, eliminating the need for additional dedicated shielding components and simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively blocks leakage magnetic flux, maintaining the coil component's characteristics while reducing electromagnetic interference, and allows for a more compact and efficient EMI shielding solution.
Implementation Method 1
a shielding layer disposed on the insulating layer and disposed at least on the other surface of the body opposing the one surface of the body
Implementation Method 2
a seed layer disposed between the insulating layer and the shielding layer. At least portions of the seed layer may penetrate into the insulating layer
Data Source
AI summary
A coil component includes: a body having one surface and the other surface opposing each other in one direction; a coil portion including a coil pattern embedded in the body and having at least one turn in the one direction; an insulating layer surrounding the body; an external electrode connected to the coil portion, penetrating through he insulating layer, and disposed on the one surface of the body; a shielding layer disposed on the insulating layer and disposed at least on the other surface of the body opposing the one surface of the body;and a seed layer disposed between the insulating layer and the shielding layer.