Coil Component Shielding Layer Thickness for EMI Reduction
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Solution Overview
Problem
Current EMI shielding technologies for electronic components are inadequate in minimizing leaked magnetic flux while maintaining component characteristics, especially in miniaturized electronic devices where electromagnetic interference (EMI) is a significant concern.
Innovation Solution
A coil component design featuring a body with a shielding layer having a thicker central portion and thinner sidewalls, an insulating layer, and a cover layer, which reduces radiated noise by efficiently blocking magnetic flux without increasing the component's size, utilizing magnetic materials and conductive layers to enhance shielding effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield can is used to surround electronic components and the board, then electromagnetic interference shielding is improved, but the overall size of the electronic device increases
Solution Approach 1:
The shielding layer is integrated within the coil component structure itself, with the coil pattern embedded in a body that contains the shielding layer. This nested configuration allows the shielding function to be incorporated into the component's internal structure rather than requiring an external shield can, thereby reducing overall device size while maintaining EMI shielding effectiveness.
Solution Approach 2:
The patent combines multiple functions into a single integrated structure: the body houses both the coil pattern (inductor function) and the shielding layer (EMI shielding function), along with insulating and conductive layers. This merging of shielding and component functions eliminates the need for separate external shielding structures.
2Object-affected harmful factors
If the shielding layer thickness is increased to improve magnetic flux blocking, then shielding effectiveness is improved, but the component size increases
Solution Approach 1:
The shielding layer is configured with non-uniform thickness, having a first thickness in a first region and a second thickness in a second region. This local variation in thickness allows optimized magnetic flux blocking in critical areas while minimizing material usage and overall component size in less critical regions.
Solution Approach 2:
The shielding layer exhibits asymmetric thickness distribution across different regions of the coil component. This asymmetric design enables targeted shielding where magnetic flux leakage is most problematic while maintaining compact overall dimensions, avoiding the need for uniform thick shielding throughout the entire component.
3Object-affected harmful factors
If a shield can is used for EMI shielding, then electromagnetic interference is reduced, but the coil component characteristics deteriorate
Solution Approach 1:
An insulating layer is positioned between the coil pattern and the shielding layer, serving as an intermediary that prevents direct contact and potential degradation of coil characteristics. This insulating barrier maintains the electrical integrity of the coil while still allowing the shielding layer to effectively block electromagnetic interference.
Solution Approach 2:
The shielding structure is divided into multiple functional layers including the insulating layer, shielding layer, and conductive layer, each performing a specific function. This segmentation allows the shielding to be effective while maintaining proper electrical isolation and preserving the coil component's inherent characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively decreases leaked magnetic flux while maintaining the coil component's characteristics, improving the miniaturization and performance of electronic devices by integrating shielding within the component itself, rather than relying on external shields.
Implementation Method 1
a shielding layer disposed on the other surface of the body
Implementation Method 2
demand for removal of a noise generation source such as electromagnetic interference (EMI) of the electronic components has gradually increased
Implementation Method 3
an insulating layer disposed between the body and the shielding layer
Data Source
AI summary
A coil component includes: a body having one surface and the other surface opposing each other in one direction; a coil portion including a coil pattern having at least one turn around the one direction, and embedded in the body; an external electrode disposed on the one surface of the body and connected to the coil portion; a shielding layer disposed on the other surface of the body; and an insulating layer disposed between the body and the shielding layer.