Coil Component Slit Lead-Out Pattern Bonding
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Solution Overview
Problem
Miniaturization and thinning of coil electronic components pose challenges in maintaining magnetic material ratios and insulating properties, leading to limitations in performance and reliability, especially during processes like dicing.
Innovation Solution
Incorporating a lead-out pattern with slits on the coil electronic component, which are filled with an encapsulant containing magnetic material, enhancing the bonding force with external electrodes and improving structural stability and electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the chip thickness is decreased to achieve miniaturization and thinning, then the device size is reduced, but the bonding force between coil pattern and encapsulant deteriorates and reliability decreases
Solution Approach 1:
The lead-out pattern is divided into multiple segments by forming slits, creating a multi-structured configuration that increases the bonding area with the encapsulant. This segmentation allows the encapsulant to bond with multiple surfaces of the lead-out pattern, thereby enhancing the overall bonding force despite reduced chip thickness.
Solution Approach 2:
The slits in the lead-out pattern create additional bonding interfaces in the vertical dimension. By forming slits that extend through the lead-out pattern, the encapsulant can bond not only with the top and bottom surfaces but also with the side surfaces of the slits, effectively increasing the bonding area in three dimensions and compensating for the reduced chip thickness.
2Reliability
If the magnetic material ratio is increased to maintain performance during miniaturization, then the magnetic characteristics are improved, but the strength of the inductor body is compromised
Solution Approach 1:
The encapsulant containing magnetic material is selectively placed in specific locations where it is needed most - within the slits of the lead-out pattern and in regions requiring enhanced bonding force. This localized placement of magnetic material provides both the necessary magnetic characteristics and structural strength without requiring a uniform increase in magnetic material ratio throughout the entire component.
3Volume of moving object
If the chip is thinned to meet slimming requirements, then the device profile is improved, but the contact area with external electrode is reduced causing electrical characteristic deterioration
Solution Approach 1:
The slits create additional bonding interfaces in the vertical dimension, allowing the encapsulant to bond with the external electrode through multiple surfaces. This multi-dimensional bonding approach compensates for the reduced contact area that would normally result from chip thinning, thereby maintaining electrical characteristics despite the reduced chip thickness.
Data Source
AI summary
A coil electronic component includes a support substrate, a coil pattern disposed on at least one surface of the support substrate, a lead-out pattern disposed on at least one surface of the support substrate to be connected to the coil pattern, an encapsulant disposed to encapsulate the support substrate, the coil pattern, and at least one portion of the lead-out pattern, and an external electrode disposed on an external surface of the encapsulant to be connected to the lead-out pattern. The lead-out pattern includes a slit disposed on a side of a region facing the external electrode. The slit is exposed in a direction toward the external electrode and in a direction away from the support substrate, on the basis of a thickness direction of the support substrate, and is not connected to the support substrate.