Coil Component Soldering Structure for Stronger Wire Joints
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Solution Overview
Problem
Soldering structures in electronics often have weak structural strength at the solder joint, leading to potential damage or breakage of conductive wires due to stripping, thermal expansion, and contraction of connected components.
Innovation Solution
A soldering structure with a conductive base featuring both a first and a second limiting member, where the conductive wire passes through and is clamped by these members, with a soldering portion covering the exposed portion between them, ensuring electrical connection and enhanced structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional soldering is used to connect conductive wire to metal surface, then electrical connection is achieved, but structural strength at the solder joint is weak
Solution Approach 1:
The conductive base is segmented into multiple functional regions including a clamping region with first and second clamping portions that are spaced apart. This segmentation allows the structure to provide both mechanical support and electrical connection functions separately, with the clamping portions providing structural strength while the soldering portion provides electrical connection, thereby resolving the contradiction between reliability and complexity.
Solution Approach 2:
The invention merges multiple functions into a single integrated conductive base structure that combines mechanical clamping (first and second clamping portions) with electrical soldering (soldering portion). This merging allows the structure to simultaneously provide structural support and electrical connection without requiring separate components, thus improving reliability while controlling complexity.
2Reliability
If conductive wire is stripped and soldered to metal surface, then electrical connection is established, but conductive wire may be damaged or pulled back and forth due to thermal expansion and contraction
Solution Approach 1:
The conductive base provides beforehand cushioning by incorporating a clamping region with first and second clamping portions that secure the conductive wire before soldering occurs. This pre-clamping structure cushions the wire against thermal expansion and contraction forces, preventing wire damage and pull-back during thermal cycling, thus improving connection stability while protecting wire integrity.
Solution Approach 2:
The conductive base acts as an intermediary between the conductive wire and the soldering portion. The clamping portions serve as intermediate structures that mechanically secure the wire, while the soldering portion provides electrical connection. This intermediary structure protects the wire from direct thermal stress and mechanical damage, resolving the contradiction between connection stability and wire integrity.
3Reliability
If soldering portion covers exposed portion and limiting members, then electrical connection is enhanced, but structural complexity increases
Solution Approach 1:
The soldering portion is merged with the clamping region to form an integrated structure where the soldering portion covers both the exposed portion of the conductive wire and the first and second clamping portions. This merging creates a unified structure that simultaneously provides electrical connection and mechanical support functions, enhancing reliability while avoiding the need for separate components and reducing overall structural complexity.
Solution Approach 2:
The soldering portion serves multiple functions: it provides electrical connection by covering the exposed conductive wire, and it provides mechanical support by covering the first and second clamping portions. This multi-functionality allows a single structure to achieve both electrical and mechanical objectives, improving reliability without increasing complexity through additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the structural strength and stability of the solder joint, reducing the risk of breakage and maintaining reliable electrical connections under thermal stress.
Implementation Method 1
the solder can be placed of the two metal surfaces to be connected and is heated to melt. When the melted solder is cool and solidifies, a solder joint is formed between the two metal surfaces
Implementation Method 2
the second limiting member clamps an end of the conductive wire
Implementation Method 3
the conductive wire is electrically connected with the conductive base
Data Source
AI summary
A soldering structure includes a conductive base, a conductive wire and a soldering portion. The conductive base includes a first limiting member and a second limiting member spaced apart from the first limiting member. The conductive wire includes a conductive portion and an insulating layer covering the conductive portion. The conductive portion includes an exposed portion exposed from the insulating layer, the conductive wire passes through the first limiting member, the exposed portion is located between the first limiting member and the second limiting member, and the second limiting member clamps an end of the conductive wire. The soldering portion at least partially covers the exposed portion, the first limiting member and the second limiting member, so that the conductive wire is electrically connected with the conductive base.