Asymmetric Coil Substrate Layout for High-Voltage Motor Winding

The patent applies asymmetry by making the inter-wiring distances asymmetric between the first and second surfaces of the flexible substrate. Specifically, the inter-wiring distance of the first wiring on the first surface is designed to be larger than the inter-wiring distance of the second wiring on the second surface. This asymmetric design ensures that when the substrate is wound into a cylindrical shape, the wiring on the inner peripheral side (first surface) maintains sufficient distance to prevent short circuits, while the outer peripheral side (second surface) can have tighter wiring for compactness.

The patent applies local quality by differentiating the inter-wiring distances at different locations (surfaces) of the flexible substrate. The first surface is designed with larger inter-wiring distance specifically at locations that will be on the inner peripheral side after winding, while the second surface has smaller inter-wiring distance. This localized quality adjustment ensures short circuit prevention where needed while maintaining overall compact structure.

The asymmetric inter-wiring distance design allows the first surface to have larger spacing for high voltage resistance while the second surface maintains tighter spacing to maximize space utilization. This resolves the contradiction by applying different spacing strategies to different surfaces based on their functional requirements.

The patent utilizes the third dimension (the thickness direction of the flexible substrate) to resolve the spacing conflict. By forming wirings on both surfaces of the substrate and connecting them through the substrate thickness, the design achieves effective wiring density without compromising the necessary spacing for voltage resistance on the critical inner peripheral side.