Coil Electronic Component Substrate Segmentation for Warpage Control
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Solution Overview
Problem
The challenge in manufacturing thin film coil components is the difficulty in accurately controlling the substrate due to warpage and deformation caused by pressure and heat during the layering of magnetic composite sheets, which complicates the reduction of component size and weight.
Innovation Solution
A coil electronic component design featuring a hexahedral body with insulating substrates and reinforcing layers that support coil portions and lead-out portions, allowing for precise control of substrate thickness and reducing deformation, while maintaining high inductance and quality factor performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the thickness of the coil substrate is reduced to decrease component size and weight, then the component size and weight are reduced, but the substrate deformation control becomes difficult due to warpage
Solution Approach 1:
The insulating substrate is segmented into a support portion and two end portions, with the end portions extending into the lead-out portions. This segmentation allows the substrate to maintain structural integrity while reducing overall thickness, preventing warpage-induced deformation during the layering process.
Solution Approach 2:
The end portions of the insulating substrate act as intermediaries between the support portion and the lead-out portions. By embedding these end portions into the lead-out portions, the substrate provides mechanical support and positioning control, preventing deformation caused by pressure and heat during manufacturing.
2Volume of moving object
If the thickness of the coil substrate is reduced to decrease component size, then the component size is reduced, but the substrate deformation control becomes difficult due to warpage
Solution Approach 1:
The insulating substrate is divided into functional segments (support portion and end portions) that can be optimized independently. The end portions are specifically designed to extend into the lead-out portions, providing positional control while allowing the overall substrate thickness to be reduced for smaller component volume.
Solution Approach 2:
Different regions of the insulating substrate have different structural characteristics. The end portions have increased thickness or extended structure where they embed into the lead-out portions, providing local reinforcement for position control, while the support portion can be thinner to reduce overall component volume.
3Reliability
If the area of coil portions is optimized to enhance inductance performance, then the inductance and quality factor are improved, but the component size increases
Solution Approach 1:
The coil portions are configured to utilize three-dimensional space efficiently by wrapping around the insulating substrate in multiple layers and directions. This allows the coil structure to achieve high inductance through optimized path length and area in multiple dimensions while maintaining a compact overall component volume.
Solution Approach 2:
The coil portions are nested around the insulating substrate core, with inner and outer coils arranged concentrically. This nested configuration maximizes the magnetic path area and inductance within a limited radial space, improving performance without proportionally increasing component volume.
Data Source
AI summary
A coil electronic component includes a body having first to fourth surfaces, an insulating substrate disposed in the body, coil portions disposed on opposing surfaces of the insulating substrate, respectively, a first lead-out portion connected to one of the coil portions and exposed from the first and third surfaces, a second lead-out portion connected to another of the coil portions and exposed from the second and third surfaces, and first and second external electrodes covering the first and second lead-out portions, respectively. The insulating substrate includes a support portion supporting the coil portions, a first end portion extending from the support portion and including end surfaces respectively exposed from the first and third surfaces and spaced apart from each other, and a second end portion extending from the support portion and including end surfaces exposed from the second and third surfaces and spaced apart from each other.