Coil Substrate with Surface-Mounted Segments for Induction Heating
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Solution Overview
Problem
Conventional coil substrates for induction heating cookers face issues with heat generation due to inter-layer heat generation and complex fabrication processes, including the need for via-hole punching, which increases costs.
Innovation Solution
A coil substrate design featuring first and second conductor layers with periodic segments and connection lines directly mounted on the substrate, eliminating the need for via-hole punching and allowing for easy heat dissipation through openings between segments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductor layers are connected through via-holes, then electrical connection between layers is achieved, but temperature rise and inter-layer heat generation occur
Solution Approach 1:
The patent extracts and eliminates the via-hole connection structure that causes heat generation. Instead of connecting conductor layers through via-holes penetrating the substrate, the invention uses surface-mounted connection conductors that connect segments on the same layer without penetrating the substrate, thereby removing the heat-generating inter-layer connection structure while maintaining electrical connectivity.
Solution Approach 2:
The patent transitions from three-dimensional via-hole connections (penetrating through the substrate thickness) to two-dimensional surface connections. The connection conductors are disposed on the surface of the substrate, changing the connection dimension from vertical (through-thickness) to horizontal (surface), which eliminates inter-layer heat generation while maintaining electrical connection.
2Reliability
If via-hole punching process is added for connecting conductor layers, then electrical connection is achieved, but fabrication complexity and process cost increase
Solution Approach 1:
The patent removes the via-hole punching process from the fabrication sequence. By using surface-mounted connection conductors instead of through-substrate via-holes, the invention eliminates the complex drilling, plating, and insulation processes associated with via-hole fabrication, thereby simplifying the overall manufacturing process and reducing costs.
Solution Approach 2:
The patent replaces the mechanical via-hole punching and plating process with a simpler conductor deposition process. Instead of mechanically drilling holes and electroplating conductive material, the invention uses screen printing or other deposition methods to create surface-mounted connection conductors, substituting a complex mechanical-electrical process with a simpler material deposition process.
3Power
If laminated structure with coils in each layer is used, then electromagnetic performance is improved, but temperature rise due to inter-layer heat generation occurs
Solution Approach 1:
The patent divides each coil layer into multiple segments with connection conductors disposed between them on the substrate surface. This segmentation allows the coil to maintain its electromagnetic functionality while distributing the current path and reducing concentrated heat generation at connection points, thereby improving thermal management while preserving electromagnetic performance.
Solution Approach 2:
The patent converts the potential harm of heat generation into a benefit by strategically disposing connection conductors in regions where they can dissipate heat more effectively. The connection conductors are positioned to utilize the substrate's thermal pathways and surface area for heat dissipation, transforming the heat-generating connection function into a heat-managing feature that maintains electromagnetic performance while controlling temperature rise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the structure and reduces process costs while effectively preventing heat generation by allowing direct heat release from the conductor layers, enhancing the efficiency of the induction heating process.
Implementation Method 1
eddy current flows when a magnetic force line generated from a working coil passes through a cooking container
Implementation Method 2
the cooking container itself is induction-heated
Implementation Method 3
the heat generated in the first and second conductor layers by the openings formed in the substrate between the segments can be easily released
Implementation Method 4
the heat generated in the first and second conductor layers by the openings formed in the substrate between the segments can be easily released
Data Source
AI summary
The coil substrate may include a substrate; a first conductor layer including a plurality of first and second segments periodically disposed on a top and a bottom of the substrate; a second conductor layer including a plurality of first and second segments periodically overlapping the first conductor layer on the top and the bottom of the substrate; a first connection line that connects the first and second segments of the first conductor layer; and a second connection line that connects the first and second segments of the second conductor layer. The first connection line includes a first region exposed on at least one of first and second surfaces that are opposite to each other of the substrate and second and third regions disposed through the substrate from both sides of the first region.