Coil Substrate Stacked Wiring for Miniaturized Inductors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing inductors using winding coils face a size limit of approximately 1.6 mm×0.8 mm due to the thickness constraint, which restricts further miniaturization and inductance enhancement.
Innovation Solution
A coil substrate with a coil-shaped wiring structure, where a thicker second wiring is layered over a thinner first wiring, filling the space between them and contacting insulating layers, allowing for a reduced plan-view size while maintaining or increasing inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a winding coil structure is used to increase inductance, then inductance is improved, but the plan-view size cannot be reduced below approximately 1.6 mm×0.8 mm due to thickness constraints
Solution Approach 1:
The patent transitions from a planar winding coil structure to a three-dimensional stacked wiring structure. Multiple wirings are arranged vertically across different layers (first wiring in lower layer, second wiring in upper layer), utilizing the thickness dimension to increase effective conductor volume without expanding plan-view area. This dimensional transition enables continued inductance enhancement while maintaining miniaturized footprint.
Solution Approach 2:
The patent implements a nested configuration where the second wiring is positioned within the vertical projection area of the first wiring, and both are embedded within the substrate thickness. The wirings are nested in multiple layers with insulating layers between them, creating a compact stacked structure that maximizes conductor volume within the limited plan-view dimensions.
2Area of stationary object
If the plan-view size is reduced to miniaturize the inductor, then area is improved, but the volume proportion of the winding coil decreases and inductance cannot be increased
Solution Approach 1:
By utilizing the vertical dimension through multi-layer stacking, the patent compensates for the reduced plan-view area. The inductance enhancement is achieved through increased effective conductor volume in the thickness direction rather than through lateral expansion, allowing miniaturized footprint while maintaining or increasing inductance.
Solution Approach 2:
The patent employs a composite structure combining multiple wiring layers with insulating materials between them. This composite arrangement creates an effective multi-layer conductor system that increases the overall conductor volume and inductance within the compact plan-view dimensions, overcoming the limitation of reduced area.
3Ease of manufacture
If a single-layer wiring structure is used, then manufacturing is simplified, but inductance enhancement is limited due to thickness constraints
Solution Approach 1:
The patent segments the conductor into multiple discrete wiring layers (first wiring, second wiring, and potentially additional wirings) separated by insulating layers. Each wiring layer can be independently formed and controlled, allowing systematic increase of total conductor volume and inductance while maintaining manufacturability through standardized multi-layer fabrication processes.
Solution Approach 2:
The patent extends the conductor structure into the vertical dimension by stacking multiple wiring layers. This multi-layer configuration increases the effective conductor volume and inductance without complicating the manufacturing process, as each layer can be formed using standard thin-film deposition and patterning techniques applied sequentially.
Data Source
AI summary
A coil substrate includes a substrate, a coil-shaped wiring provided on one surface of the substrate, the coil-shaped wiring including adjacent parts provided adjacent to each other, and an insulating layer formed between the adjacent parts of the coil-shaped wiring. The coil-shaped wiring includes a first wiring, and a second wiring that is layered on the first wiring and has a thickness greater than a thickness of the first wiring. A space is provided between a side surface of the first wiring and the insulating layer. The second wiring fills the space and covers the first wiring. Both side surfaces of the second wiring contact the insulating layer.