Coil Component Tapered Via Structure for Void-Free Plating
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Solution Overview
Problem
The challenge in coil component manufacturing is the occurrence of void defects during the plating process when forming via holes, which affects the connectivity and efficiency of coil components, particularly in miniaturized electronic devices.
Innovation Solution
A coil component design with a tapered via structure, where the ratio of the upper surface diameter to the lower surface diameter of the via is controlled between 1.06 and 1.64, and the via is processed on only one side of the support member using laser irradiation, reducing void defects and improving production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a via hole is formed through the support member to connect coil portions, then connectivity between coil portions is achieved, but void defects occur during the plating process
Solution Approach 1:
The via hole is designed with an asymmetric tapered structure where the upper diameter is larger than the lower diameter. This asymmetric geometry prevents void formation during plating by ensuring uniform metal deposition throughout the via, while still achieving reliable electrical connectivity between the coil portions on opposite surfaces of the support member.
Solution Approach 2:
The via hole dimensions are controlled within specific parameter ranges: the upper diameter is 3μm to 6μm, the lower diameter is 2μm to 4μm, and the diameter ratio is 1.06 to 1.64. These parameter optimizations ensure both void-free plating and reliable connectivity, resolving the contradiction between manufacturing precision and reliability.
2Volume of moving object
If the support member is made thin for miniaturization, then device size is reduced, but via hole formation becomes more difficult
Solution Approach 1:
Traditional mechanical drilling methods are replaced with laser irradiation to form via holes through the thin support member. This substitution enables precise via formation in miniaturized structures without the mechanical stress and complexity associated with conventional drilling, thus achieving both device miniaturization and ease of manufacture.
Solution Approach 2:
The via hole is formed through the support member before the plating process. This preliminary action ensures that the tapered structure is already in place to guide uniform metal deposition, making the subsequent plating process simpler and more reliable despite the thin support member thickness.
3Reliability
If conventional via hole formation processes are used, then via holes can be formed, but production efficiency is reduced due to multiple process operations
Solution Approach 1:
The via hole formation and plating processes are merged into a single integrated operation using laser irradiation. The laser process simultaneously creates the tapered via hole and prepares the surface for plating, eliminating the need for separate drilling, etching, and plating steps. This consolidation maintains via hole quality while significantly improving production efficiency.
Solution Approach 2:
The laser irradiation process continuously forms the via hole and prepares the plating surface in one uninterrupted action. This continuous process eliminates idle time between operations and maintains optimal conditions throughout via formation, thereby improving productivity without compromising via hole quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces void defects and short-circuit defects, enhances the connectivity of coil portions, and increases production efficiency by ensuring smooth plating and minimizing process operations.
Implementation Method 1
it is possible to process a via hole VH by irradiating a laser on only one side of the support member 200
Data Source
AI summary
A coil component includes: a body having a first surface and a second surface opposing each other; a support member disposed in the body, and having one surface and the other surface opposing each other; a coil including first and second coil portions disposed on the one surface and the other surface of the support member and having at least one turn, respectively, and a via connecting the first and second coil portions; and first and second external electrodes respectively disposed on the first and second surfaces of the body and connected to the coil, wherein the via includes an upper surface in contact with the first coil portion and a lower surface in contact with the second coil portion, and a ratio VDU/VDL of a diameter VDU of the upper surface to a diameter VDL of the lower surface is 1.06 or more and 1.64 or less.