Coil Terminal Flange Routing to Limit Solder Joint Heating
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Solution Overview
Problem
Existing coil devices experience decreased joinability and joint strength between the mounting portion and the mounting substrate due to heat transfer from the wire connecting portion, leading to potential detachment of the coil device.
Innovation Solution
The coil device incorporates an intermediate portion with a route extending over the end surface and side surface of the flange, increasing the distance between the mounting portion and the wire connecting portion, thereby reducing heat transfer and mitigating temperature rises.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the intermediate portion extends along the shortest route between the mounting portion and the wire connecting portion, then the device complexity is reduced, but the temperature rise of the mounting portion increases due to heat transfer
Solution Approach 1:
The intermediate portion extends not only in the planar direction but also in the thickness direction of the flange, utilizing three-dimensional space to increase the heat transfer path length without significantly increasing the overall footprint of the device. This spatial arrangement effectively reduces heat transfer while maintaining compact device dimensions.
2Temperature
If the distance between the mounting portion and the wire connecting portion is increased, then the temperature rise of the mounting portion is reduced, but the device complexity increases
Solution Approach 1:
The intermediate portion utilizes the thickness direction of the flange to increase the distance between the mounting portion and the wire connecting portion. By extending through the flange thickness and along the side surface, the heat transfer path is lengthened without requiring a larger planar footprint, thus controlling device size while reducing temperature rise.
3Reliability
If the intermediate portion extends over the end surface and side surface of the flange, then the joinability of the mounting portion is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The intermediate portion extends along the side surface of the flange in the thickness direction, utilizing the vertical dimension to achieve better heat isolation. This three-dimensional configuration provides natural mechanical support and positioning, reducing the need for high-precision manufacturing while ensuring reliable joinability of the mounting portion to the mounting substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the joinability of the mounting portion with the mounting substrate, enhances the quality of the joint, and prevents misalignment of the lead-out portion, resulting in increased reliability and stability of the coil device.
Implementation Method 1
heat is transferred from the wire connecting portion to the mounting portion, and the temperature of the mounting portion rises
Data Source
AI summary
A coil device includes a wire, a core, and a terminal fitting. The wire includes a winding portion and a lead-out portion drawn out from the winding portion. The core includes a shaft and a flange at one end of the shaft. The shaft has the winding portion wound around. The terminal fitting includes a mounting portion connectable to a mounting substrate, a wire connecting portion connected to the lead-out portion, and an intermediate portion connecting the mounting portion and the wire connecting portion. The mounting portion and the wire connecting portion are disposed over a mounting surface of the flange. The intermediate portion has a route extending over an end surface of the flange and a side surface of the flange to connect the mounting portion and the wire connecting portion.