Coil Component Terminal Layout to Prevent Magnetic Layer Shorting
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Solution Overview
Problem
In coil components with interlayer insulating films and conductor layers stacked on a magnetic body layer, short-circuit failures can occur when the magnetic body layer contains metal materials like Fe, especially when the film thickness of the interlayer insulating film is small.
Innovation Solution
The coil component design includes a first magnetic body layer with alternately stacked interlayer insulating films and conductor layers, where the conductor layers have terminal patterns connected through via conductors penetrating the insulating films, ensuring insulation between terminal patterns and preventing short-circuit failures, even with thin interlayer films. Additionally, terminal electrodes can be arranged on the surface or side surfaces, and the second terminal pattern can be in a floating state or embedded within the insulating film to avoid barrel plating and adjust process conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the film thickness of the interlayer insulating film is reduced, then the device size is reduced, but short-circuit failure occurs through the magnetic body layer
Solution Approach 1:
The patent divides the terminal pattern of the first conductor layer into multiple segments (first terminal pattern and second terminal pattern) that are electrically insulated from each other. This segmentation prevents potential short-circuit paths through the magnetic body layer while maintaining the reduced film thickness of the interlayer insulating film, thus resolving the contradiction between device miniaturization and reliability.
2Reliability
If the interlayer insulating film thickness is increased, then short-circuit prevention is improved, but device size increases
Solution Approach 1:
Instead of increasing the insulating film thickness, the patent segments the terminal pattern into electrically isolated portions (first and second terminal patterns). This approach achieves short-circuit prevention through electrical insulation of pattern segments rather than relying solely on increased physical barrier thickness, thereby avoiding device size increase.
3Reliability
If the terminal pattern is continuous, then electrical connectivity is improved, but short-circuit risk increases
Solution Approach 1:
The terminal pattern is segmented into multiple electrically insulated portions (first terminal pattern and second terminal pattern) that are separated by insulating structures. This segmentation eliminates continuous conductive paths that could create short-circuit risks through the magnetic body layer, while via conductors provide controlled electrical connectivity where needed.
Solution Approach 2:
The patent introduces via conductors as intermediary elements that provide controlled electrical connections between conductor layers. These via conductors act as mediators that enable necessary electrical connectivity while preventing unwanted direct contact between terminal patterns through the magnetic body layer, thus resolving the contradiction between connectivity and short-circuit risk.
Data Source
AI summary
To prevent the occurrence of a short-circuit failure through a magnetic body layer. A coil component includes interlayer insulating films and conductor layers which are alternately stacked on a magnetic body layer. The conductor layers respectively have coil patterns, terminal patterns which are provided at positions overlapping a terminal electrode, and terminal patterns which are provided at positions overlapping a terminal electrode. The terminal patterns are connected to the terminal electrode, and the terminal patterns are connected to the terminal electrode. The terminal pattern is insulated from the terminal electrode. This can prevent a short circuit failure between a coil pattern or terminal pattern and the terminal pattern through the magnetic body layer.