Coil Transducer Isolator Package Spatial Layout
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Solution Overview
Problem
Optical isolation systems consume more power and are slower compared to magnetic induction systems due to the inefficiency of photoelectrons generated in photo-detectors versus photons in LEDs, necessitating a more efficient electrical isolation method.
Innovation Solution
A coil transducer isolator package is designed with a lead frame and flexible circuit configuration that keeps the lead frame outside the spatial volume defined by the metal coils, reducing inductance and enhancing signal transmission speed, and using polyimide substrates for improved electrical properties and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical isolation systems are used to achieve electrical isolation between two electrical systems, then signal transmission can be achieved, but power consumption increases and transmission speed decreases
Solution Approach 1:
The patent replaces optical isolation systems with magnetic induction isolation systems using coil transducers. This substitution eliminates the need for photo-detectors and LEDs, thereby reducing power consumption while maintaining electrical isolation functionality through magnetic field coupling between primary and secondary coils.
Solution Approach 2:
The patent changes the isolation mechanism from optical to magnetic induction, fundamentally altering the physical principle used for signal transmission across the isolation barrier. This parameter change enables more efficient energy transfer and faster response times while preserving galvanic isolation.
2Reliability
If optical isolation systems are used to achieve electrical isolation, then signal transmission can be achieved, but transmission speed becomes slower
Solution Approach 1:
The patent replaces optical isolation systems with magnetic induction isolation systems using coil transducers. This substitution eliminates the need for photo-detectors and LEDs, thereby reducing power consumption while maintaining electrical isolation functionality through magnetic field coupling between primary and secondary coils.
Solution Approach 2:
The patent changes the isolation mechanism from optical to magnetic induction, fundamentally altering the physical principle used for signal transmission across the isolation barrier. This parameter change enables more efficient energy transfer and faster response times while preserving galvanic isolation.
3Device complexity
If lead frame is placed within the spatial volume of metal coils, then package structure is simplified, but inductance increases and signal transmission speed decreases
Solution Approach 1:
The patent extracts the lead frame from the spatial volume enclosed by the metal coils. By positioning the lead frame outside this volume, the design eliminates parasitic inductance effects that would otherwise degrade signal transmission speed, while still achieving a compact package structure through careful spatial arrangement.
Solution Approach 2:
The patent applies different spatial positioning strategies to different components: the coil transducer occupies the central volume for magnetic coupling, while the lead frame is positioned in the surrounding area for electrical connection. This local quality differentiation optimizes both signal transmission and package integration.
4Manufacturing precision
If silicon substrate is used for coil transducer, then manufacturing precision can be achieved, but production cost increases
Solution Approach 1:
The patent substitutes expensive silicon substrates with cheaper alternative substrates for coil transducer fabrication. While silicon offers superior manufacturing precision, the patent demonstrates that alternative substrates can achieve adequate performance at lower production costs, making the overall system more economically viable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coil transducer isolator package achieves faster signal transmission and reduced power consumption by minimizing inductance and signal reduction, while allowing for a smaller or more efficient package size, thus improving the efficiency of electrical isolation.
Implementation Method 1
A coil transducer formed as part of one or more substrates may be used in conjunction with a magnetic induction isolation system
Data Source
AI summary
In an embodiment, the invention provides a coil transducer isolator package comprising at least one lead frame, at least two integrated circuits (ICs) and a flex circuit comprising at least a first coil transducer. The first coil transducer comprises at least one metal coil. The coil transducer isolator package is fabricated such that no portion of the lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil. The boundaries of the spatial volume are defined by a periphery of the at least one metal coil. At least one of the two ICs is at least partially located within the spatial volume extending substantially perpendicular to the at least one metal coil.