Coil Electronic Component Via Edge Placement

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Solution Overview

Problem

Existing thin film power inductors face challenges with plating non-uniformity, leading to deviations in coil pattern line widths and thicknesses, which deteriorate electrical characteristics and hinder miniaturization efforts in electronic components.

Innovation Solution

A coil electronic component design featuring a support member with a through-hole and via structures that minimize plating non-uniformity by integrating the via at the edge of the through-hole, allowing for uniform magnetic flux flow and improved permeability, while maintaining a small size and high inductance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional plating methods are used for coil patterns, then manufacturing process is simple, but plating non-uniformity occurs leading to deviations in coil pattern line widths and thicknesses

Engineering Contradiction:

Improvecoil pattern line width uniformityVSAvoidvia structure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The via is formed at the edge of the through-hole in advance before coil pattern plating, creating a preliminary magnetic flux path that guides uniform plating deposition. This preliminary structural arrangement prevents plating non-uniformity without requiring complex process modifications

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The via structure acts as an intermediary element between the through-hole and the coil patterns, mediating the magnetic flux flow to ensure uniform distribution. This intermediary structure enables uniform plating by controlling the underlying magnetic field distribution

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If via is formed away from through-hole edge, then manufacturing is easier, but magnetic flux flow becomes non-uniform reducing permeability

Engineering Contradiction:

Improvemagnetic flux uniformityVSAvoidvia positioning difficulty

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The via is specifically positioned at the edge of the through-hole rather than in the center or random location, creating a localized optimal structure. This specific positioning provides both manufacturing ease (aligned with through-hole edge) and magnetic flux uniformity (edge location optimizes flux distribution)

Inventive Principle:

Principle #3Local quality

3Reliability

If coil patterns are made larger to compensate for plating non-uniformity, then electrical characteristics improve, but component size increases hindering miniaturization

Engineering Contradiction:

Improveelectrical characteristicsVSAvoidinductor size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The via structure creates a controlled magnetic flux pathway similar to how fluid channels control flow. By guiding magnetic flux through the via at the through-hole edge, the system achieves uniform flux distribution that maintains electrical characteristics without requiring larger component dimensions

Inventive Principle:

Principle #29Pneumatics and hydraulics

Data Source

PatentUS11282634B2Coil electronic component

Publication Date: 2022.03.22 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A coil electronic component includes a body and external electrodes disposed on an external surface of the body. The body includes a support member including a through-hole, upper and lower coils supported by the support member and including a plurality of coil patterns, a via connecting the upper and lower coils to each other, and an insulating wall supported by the support member and insulating adjacent coil patterns from each other. The via is formed on at least a portion of a interface of the through-hole.