Coil Component Via Hole Integration for Inductance and Reliability
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Solution Overview
Problem
Thin film type inductors used in mobile devices face challenges in achieving high inductance with low direct current resistance and miniaturization, particularly in maintaining a high aspect ratio while ensuring reliable connections between coils, which is complicated by the need for vias connecting coils.
Innovation Solution
A coil component with a magnetic body and external electrodes, featuring a support member with a through hole and via hole filled with magnetic material, and conductive layers on the side and surface of the support member, where the second conductive layer is integrally formed with the coil layer to enhance the aspect ratio and connection reliability, and a method for manufacturing this component involving the formation of conductive layers and encapsulation with magnetic material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the width of coils is decreased and height is increased to increase aspect ratio, then miniaturization of thin film type inductors is achieved, but the reliability of coil connections deteriorates
Solution Approach 1:
The patent merges the via structure with the coil pattern by making the coil pattern extend directly into and fill the via hole. This integration eliminates the need for separate via filling processes and creates a unified conductive path that maintains reliability while achieving miniaturization.
Solution Approach 2:
The patent utilizes the vertical dimension by extending the coil pattern into the via hole depth direction. This allows the coil to occupy three-dimensional space effectively, increasing the aspect ratio while maintaining connection reliability through the continuous conductive path from surface to via bottom.
2Reliability
If traditional via connection structures are used, then coil connections can be established, but the manufacturing process becomes complicated
Solution Approach 1:
The patent combines the via formation and coil pattern formation into a single integrated structure. The coil pattern is designed to extend into the via hole, eliminating the need for separate via filling and insulation processes, thereby simplifying manufacturing while maintaining connection reliability.
Solution Approach 2:
The conductive layer serves multiple functions simultaneously: it forms the coil pattern on the surface, fills the via hole to create electrical connection, and provides structural support. This multi-functionality reduces the number of manufacturing steps and simplifies the overall process.
3Reliability
If high aspect ratio coils are implemented, then inductance increases and direct current resistance decreases, but manufacturing precision requirements increase
Solution Approach 1:
The via hole is formed and prepared in advance before the coil pattern is deposited. This preliminary preparation ensures that the via hole dimensions and positioning are controlled with high precision before the coil material is applied, facilitating accurate coil formation with high aspect ratio.
Solution Approach 2:
The coil structure is segmented into surface coil portions and via-filled portions, allowing different manufacturing approaches for each segment. The surface coil can be formed with standard precision, while the via portion benefits from the pre-formed via hole structure, collectively achieving high aspect ratio with manageable precision requirements.
Data Source
AI summary
A coil component includes a magnetic body and an external electrode disposed on an external surface of the magnetic body. The magnetic body includes a support member including a through hole, filled with a magnetic material, and a via hole, a coil disposed on at least one surface of the support member, and a magnetic material encapsulating the coil and the support member. A first conductive layer is disposed on a side surface of the via hole formed in the support member and the at least one surface of the support member. The via hole is filled with a portion of the second conductive layer disposed on the first conductive layer.