Coil Component Via Pad Segmentation for Inductance Stability
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Solution Overview
Problem
In thin film power inductors, the wide via pads required for electrical connection between coil layers can lead to excessive plating and a reduction in the core area, compromising inductance characteristics and connection reliability due to increased metal layer heights and interference in magnetic paths.
Innovation Solution
The design incorporates via pads with inverted T-shaped structures, featuring connection portions and wing portions that reduce the occupied area while maintaining connection reliability, with line widths equal to or smaller than the coil patterns, to minimize interference and enhance inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If via pads are made wider to ensure alignment between via and coil, then connection reliability is improved, but excessive plating occurs and core area is reduced
Solution Approach 1:
The via pad is segmented into a connection portion and wing portions. The connection portion ensures reliable electrical connection between via and coil pattern, while the wing portions extend laterally to provide alignment tolerance without significantly increasing the area occupying the core region. This segmentation allows the via pad to fulfill multiple functions with optimized area distribution.
Solution Approach 2:
Different portions of the via pad have different functional qualities: the connection portion has larger area for reliable electrical connection, while the wing portions have extended lateral coverage for alignment tolerance but minimal core area occupation. This local differentiation allows the via pad to achieve both connection reliability and core area preservation.
2Manufacturing precision
If via pads are made wider to ensure alignment, then alignment tolerance is improved, but inductance characteristics deteriorate due to reduced core area
Solution Approach 1:
The via pad structure is divided into connection portions for electrical connection and wing portions for alignment coverage. The wing portions extend laterally to provide alignment tolerance while the connection portions are optimized to minimize core area occupation, thereby preserving inductance characteristics.
Solution Approach 2:
The via pad structure transitions from a conventional wide pad to an inverted T-shape where the wing portions extend in the lateral dimension to provide alignment tolerance, while the connection portions maintain compact dimensions in the core area to preserve inductance characteristics.
3Area of stationary object
If via pads have wider line width than coil patterns, then connection area is increased, but magnetic path interference increases and inductance decreases
Solution Approach 1:
The via pad is segmented into connection portions that interface with the coil pattern and wing portions that extend laterally. The connection portions have line widths matched to the coil pattern for adequate connection area, while the wing portions extend perpendicular to the magnetic path to provide alignment tolerance without interfering with magnetic flux distribution.
Solution Approach 2:
The via pad structure uses dimensional optimization where connection portions match coil pattern dimensions for adequate connection, while wing portions extend in the lateral dimension to provide alignment tolerance without increasing the footprint in the magnetic path direction, thereby minimizing magnetic interference.
Data Source
AI summary
A coil component includes: a body including a magnetic material; a substrate disposed in the body; a coil unit including first and second coil patterns disposed on both surfaces of the substrate, respectively, first and second via pads connected to inner ends of the first and second coil patterns, respectively, and a via connecting the first and second via pads to each other; and first and second external electrodes disposed to be spaced apart from each other on the body, while respectively being connected to the coil unit, wherein the first and second via pads include connection portions connected to the first and second coil patterns, respectively, and wing portions protruding from both side surfaces of the connection portions, and each of the first and second via pads has substantially the same or smaller line width than each of the first and second coil patterns.