Cold Foil Transfer Layer Segmentation for Conductor Crack Prevention
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Solution Overview
Problem
Cold foil transfer methods for printing electrical or electronic structures often result in cracks in the transfer layer, which can disrupt the current-conducting function of linear conductors, as the rough surface of the rubber blanket causes long, continuous transverse cracks, leading to functional failures.
Innovation Solution
Introducing predetermined breaking points in the transfer layer, which can be achieved through various means such as embossing, granulation, or using an adhesive structure, to create short cracks that do not completely interrupt the conductor track, ensuring an uninterrupted flow of current.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rough surface rubber blanket is used in cold foil transfer, then the transfer layer adheres well to the substrate, but long continuous transverse cracks form in the transfer layer disrupting current conduction
Solution Approach 1:
The invention segments the transfer layer by introducing predetermined breaking points that create multiple short cracks instead of one long continuous crack. These breaking points are arranged in a grid pattern and divide the transfer layer into smaller segments, preventing the formation of long continuous cracks that would disrupt current conduction while maintaining adequate adhesion through the segmented structure.
Solution Approach 2:
The invention applies preliminary action by pre-forming breaking points in the transfer layer before the cracking occurs during the transfer process. These breaking points are created through embossing or perforation mechanisms that prepare the transfer layer in advance, ensuring that when mechanical stress occurs during transfer, the cracks form at predetermined locations rather than randomly, preventing long continuous crack formation.
2Object-generated harmful factors
If a smooth surface rubber blanket is used, then cracks are reduced, but adhesion of the transfer layer to the substrate is compromised
Solution Approach 1:
The segmented structure created by predetermined breaking points allows the transfer layer to maintain adhesion through the segments while accommodating stress through the controlled breaking points. The segmentation enables the layer to flex and adhere without forming long continuous cracks, as each segment can independently accommodate minor stress variations.
Solution Approach 2:
The invention applies local quality by creating specific breaking points at predetermined locations while maintaining intact transfer layer material elsewhere. The breaking points are localized features that provide stress relief without compromising the overall adhesion of the transfer layer to the substrate, as the majority of the transfer layer remains continuous and bonded.
3Reliability
If predetermined breaking points are created in the transfer layer, then short cracks form reducing mechanical stress, but the structure becomes more complex
Solution Approach 1:
The predetermined breaking points are formed through preliminary embossing or perforation actions during the manufacturing process. This preliminary action simplifies the overall structure by pre-determining where cracks will form, eliminating the need for complex post-processing or adjustment mechanisms. The breaking points are created using standard embossing rollers or perforating devices that integrate into existing cold foil transfer equipment.
Data Source
Figure 1~2
Figure 3
Figure 4a~4b
AI summary
In a method for printing electrical or electronic structures by means of cold foil transfer, predetermined breaking points (6) are created in the transfer layer (2), and in a device for printing electrical or electronic structures by means of cold foil transfer, means for creating predetermined breaking points (6) in the transfer layer (2) are provided.