Cold Gas Sprayed Contact Elements for Multi-Layer Systems
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Solution Overview
Problem
Existing methods for creating conductor tracks and electrical contacts in multi-layer systems are complex and limited to the surface, making it difficult to connect deeper-lying layers, and often involve high thermal stress.
Innovation Solution
A method using cold gas spraying to apply a contact element that penetrates the upper layer and contacts the lower layer, allowing for easy and efficient electrical connection within multi-layer systems, particularly in photovoltaic cells, using conductive materials like aluminum or transparent conductive oxides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If thermal spraying is used to apply electrically conductive material, then the material can be applied over a large area, but the method cannot contact deeper-lying layers and requires subsequent removal of material to create desired shapes
Solution Approach 1:
The patent replaces thermal spraying with cold gas spraying technology. This substitution allows the contact element to be applied in a cold state, enabling it to penetrate through upper layers and directly contact lower-lying conductive layers without requiring subsequent material removal. The cold gas spraying process delivers kinetic energy to the contact element material, allowing it to impact and adhere to deeper layers while maintaining the ability to cover large areas.
2Reliability
If beam-bound thermal-kinetic application process is used to apply conductor track directly to carrier component, then deeper layers can be contacted, but the application is very complex and only possible during creation of carrier component
Solution Approach 1:
The patent replaces the complex beam-bound thermal-kinetic application process with cold gas spraying. The cold gas spraying technology uses a jet of cold gas to accelerate contact element material particles, which then impact and adhere to the carrier component and penetrate through upper layers to contact lower conductive layers. This method is less complex and can be applied at any stage of carrier component production, not just during initial creation.
3Reliability
If etching is used to introduce recess in upper layer for contacting underlying layer, then deeper layers can be contacted, but the process involves high thermal stress and complexity
Solution Approach 1:
The patent replaces the etching process with cold gas spraying. Instead of using thermal or chemical etching to create recesses in upper layers, the cold gas spraying technology directly deposits contact element material that penetrates through the upper layers and contacts the underlying conductive layer. This mechanical deposition process occurs at low temperatures, eliminating the high thermal stress associated with etching methods.
4Ease of manufacture
If conventional methods are used to produce conductor tracks on surface, then the process is simple, but electrical contacting of deeper-lying layers is complex or impossible
Solution Approach 1:
The patent replaces conventional surface-only conductor track production methods with cold gas spraying technology. The cold gas spraying process applies contact element material that is accelerated by a cold gas jet, enabling the material to penetrate through upper layers and create electrical contacts with deeper-lying conductive layers. This maintains process simplicity while achieving the ability to contact deeper layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables simple and thermally gentle connection of deeper layers, reducing thermal stress and complexity, and achieving high electrical conductivity, suitable for various applications including surface resistance heating and photovoltaic cells.
Implementation Method 1
The contact element is applied using cold gas spraying
Data Source
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AI summary
The invention relates to a layer system comprising a contact element (5) and a substrate (1). A multilayer system (14) that is disposed on the substrate (1) has at least one top layer (3; 4) and a bottom layer (2; 3) as well as a contact element (5) which penetrates the at least one top layer (3; 4) and contacts the bottom layer (2; 3). The invention further relates to a method for producing a contact element (5) of a multilayer system (14).