Cold Plate Module With Absorbing Element For Leakage Protection

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Solution Overview

Problem

The existing cooling systems in computer equipment face challenges with cooling liquid leakage due to poor connections, which can damage other electronic components.

Innovation Solution

A cold plate module is designed with a cold plate, a structural piece, a frame, and an absorbing element. The absorbing element is located between the entrance and exit of the inlet and outlet ports, respectively, to absorb any leaked cooling liquid, while the frame forms a complete enclosure to prevent further leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If cooling liquid is used as a circulated medium to enhance heat dissipation, then the heat dissipation effect is improved, but the risk of cooling liquid leakage increases which may damage electronic components

Engineering Contradiction:
Improveheat dissipation effectVSAvoidcooling liquid leakage damage
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an absorbing element (sponge) within the cold plate structure that acts as a buffer to absorb leaked cooling liquid before it can reach and damage electronic components. This beforehand cushioning measure is integrated into the cold plate design, allowing the system to maintain effective heat dissipation while having built-in protection against leakage damage.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Object-affected harmful factors

If the absorbing element is added to prevent cooling liquid leakage damage, then the protection of electronic components is improved, but the device complexity increases

Engineering Contradiction:
Improveprotection of electronic componentsVSAvoidstructure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The absorbing element is integrated within the cold plate structure itself, merging the heat dissipation function and the leakage protection function into a single unified component. The sponge is positioned within the liquid storage space of the cold plate, eliminating the need for separate protection mechanisms and reducing overall system complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The cold plate structure is designed to serve multiple functions: it provides heat dissipation through the circulating cooling liquid, stores excess cooling liquid in its liquid storage space, and uses the integrated absorbing element to prevent leakage damage. This multi-functionality reduces the need for additional separate components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents cooling liquid from leaking onto other electronic components, reducing the risk of damage and providing additional protection even when the absorbing element becomes saturated.

Implementation Method 1

The absorbing element is at least partially located between the fourth surface and both of the entrance and the exit... effectively prevents cooling liquid from leaking onto other electronic components

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS12309968B2Cold plate module
Publication Date: 2025.05.20 ACCTON TECHNOLOGY CORPORATION
  • US12309968B2 patent drawing
  • US12309968B2 patent drawing
  • US12309968B2 patent drawing

AI summary

A cold plate module includes a cold plate, a structural piece, a frame and an absorbing element. The cold plate includes a body, an inlet and an outlet. The body has a first and a second surfaces. The first surface abuts a heat source on a motherboard. The inlet and the outlet communicate with the body. The structural piece has a third and a fourth surfaces. The third surface connects the second surface. The structural piece connects the motherboard. The frame connects and defines a space with the fourth surface. The inlet and the outlet locate within the space. The absorbing element connects the fourth surface within the space. The inlet and the outlet penetrate through the structural piece and the absorbing element. The absorbing element locates between the fourth surface and both of an entrance of the inlet and an exit of the outlet.