Integrated Cold Plate Bonding for Low-Resistance Chip Cooling
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Solution Overview
Problem
Existing cooling systems for microelectronic devices suffer from reduced efficiency due to high thermal resistance at interfacial boundaries and within thermal interface materials, leading to increased chip temperatures and reduced performance.
Innovation Solution
The integration of a cold plate with a semiconductor device using direct or hybrid bonding techniques, eliminating intervening adhesives and enhancing heat transfer through coolant channels, thereby reducing thermal resistance and improving cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal interface materials are used to facilitate heat transfer between chip and heat dissipation device, then thermal coupling is enhanced, but the combined thermal resistance of the interface boundaries and the thermal interface material itself inhibits heat transfer
Solution Approach 1:
The patent removes the thermal interface material from the heat transfer path between the cold plate and semiconductor device. By directly bonding the cold plate to the device, the thermal interface material and its associated thermal resistance are extracted from the system, eliminating the energy loss caused by thermal resistance at interfaces.
Solution Approach 2:
The patent merges the cold plate and semiconductor device into a single integrated structure through direct or hybrid bonding. This combining eliminates the separate thermal interface material layer and reduces the number of interfacial boundaries, thereby reducing cumulative thermal resistance and improving heat transfer efficiency.
2Reliability
If multiple components are placed between heat dissipating sources and heat dissipation devices, then cooling functionality is provided, but system thermal resistance increases cumulatively along heat transfer paths
Solution Approach 1:
The patent extracts and removes unnecessary intermediate components from the heat transfer path. By using direct bonding between the cold plate and semiconductor device, intermediate thermal interface materials and their associated thermal resistances are taken out of the system, reducing cumulative thermal resistance while maintaining cooling functionality.
Solution Approach 2:
The patent applies preliminary action by performing direct bonding between the cold plate and semiconductor device during manufacturing, eliminating the need for separate thermal interface material application and reducing the number of assembly steps. This preliminary integration reduces system thermal resistance from the outset.
3Loss of energy
If conventional cooling systems with multiple components are used, then heat dissipation is achieved, but manufacturing complexity and assembly steps increase
Solution Approach 1:
The patent merges the cold plate and semiconductor device into a single integrated structure through direct or hybrid bonding techniques. This merging reduces the number of separate components and assembly steps, simplifying manufacturing while maintaining effective heat dissipation functionality.
Solution Approach 2:
The cold plate is designed to serve multiple functions: it provides structural support, enables direct thermal contact with the semiconductor device, and facilitates heat dissipation through integrated coolant channels. This multi-functionality reduces the need for separate components, simplifying the overall system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces thermal resistance and enhances heat dissipation, maintaining optimal operating temperatures and improving the energy efficiency of semiconductor devices.
Implementation Method 1
enhancing heat transfer through coolant channels, thereby reducing thermal resistance
Implementation Method 2
enhancing heat transfer through coolant channels
Data Source
AI summary
A device package comprising an integrated cooling assembly. The device package comprises a semiconductor device attached to a substrate and a cold plate attached to the semiconductor device. The cold plate's footprint is larger than the footprint of the semiconductor device so one or more portions of the cold plate extends past the edges of the semiconductor device's footprint. One or more standoffs are disposed adjacent to the semiconductor device to support the one or more portions of the cold plate that extend past the edges of the semiconductor device's footprint.